www.automation.datalogic.com
GREEN-LASE SERIES
The Green-Lase 4W and 10W
laser
sources and markers operate on the
V-Lase platform and use Second
Harmonic Generation (SHG) in an
intracavity architecture, which maximizes
LBO non-linear crystal conversion
efficiency. The Green-Lase wavelength
results in a lower “heat affected zone”
compared with an infrared
laser. This
effective
laser source thus offers
significant advantages in marking
applications with materials such as plastics
that do not interact with the original
infrared wavelength, as well as with
semiconductors such as silicon (e.g. wafer
marking). Superior absorption coefficient in
semiconductor material used in solar cells
makes this source ideal for photovoltaic
applications (e.g.: thin film scribing)
V-LASE PLATFORM
• The V-Lase platform derives from the
long experience in the production of high
performance and high quality DPSS
laser sources. The Green-Lase@532nm
use the state-of-the-art End Pumped
Coupling Technology,which represents
the leading-edge solution in the field of
laser sources.
• The platform is characterized by a
standard compact case, continuous
and precise power control and low
power consumption. Moreover, special
attention has been dedicated to the
safety aspects. The proprietary endpumped
architecture using a TE cooled
diode
laser pump with unmatched
MTBF, assures the reliability and
availability of the system.
• The V-Lase platform offers
lasers with
excellent beam quality, high peak power
and short pulse width. The operator is
able to precisely tune the power and
pulse repetition rate. Very high brilliance
in the
laser spot, at longer focal lengths,
makes the V-Lase platform ideal for
marking a broad range of materials,
even with large marking fields.
• Designed for very demanding 24/7
processes, the V-Lase platform
offers unparalleled performance and
represents the ideal solution for both
direct part marking and label marking
in every market segment including
automotive, solar & electronics,
packaging, as well as in medical surgical
tools marking and other applications.
• The V-Lase platform significantly
extends the possibility of connection
between the
laser source and the
operating system. The communication
with the system is enabled by RS232. In
addition, the V-Lase platform also has
an I/O for the connection of the TTL and
analogue signals. Ethernet connection is
available for monitoring.
LASER MARKing
FEATURES & BENEFITS
• Easy integration and configuration
• High reliability
• Lower “heat affected zone”
• Ideal solution for PCB marking
• Excellent marking results on
semiconductors and silicon and on
materials such as non-doped plastics
not interacting with IR
• State-of-the art marking kit including
user friendly marking software
APPLICATIONS
This product series has been developed to satisfy to requirements of the following
reference applications in automotive and electronics & solar, among the others.
• Marking of plastic (when not sensitive to IR) and thin film ablation
• Marking on silicon and semiconductors and others applications in the electronics Industry
GLRAEENS-LAESER MARKING
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