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Finishing machine, Abrasive powder, Polishing pad, Diamond, Lapping machine
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| KflMW LAM-'ffiffffiÖ' LAPPING AND POLISHING SYSTEM | ||||||
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| | 25 years ago LAM PLAN® was already innovating with launching of the NEW LAM® M'M' patented Lapping System. LAM PLAN® improves continuously its system to answer all new technical requirements of customers. The system patented in France, Europe, USA, Japan, Korea, etc., is unique and unequalled in the Lapping-Polishing process. The NEW LAM® M'M' plate finds its origin in the LAM PLAN® abrasion technique and uses the free diamond abrasive for its functionning. As soon as the plate rotates, under the effect of the initial weight of the parts and of the load applied by the pneumatic cylinders of the machine, the diamond grits alternately move and get settled to ensure an abrasive action on the surface of the partstobelapped. | |||||
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| THE PATENT The shape and the distribution of the two components of the plate, allow an optimum alternation between the hard and soft zones, that insures the FLATNESS of the part and modifies permanently the cutting angle of the diamond grit, to garanty a high return. | ||||||
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| DIAMOND LIQUID | ||||||
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| -The NEWLAM® M'M' is designed to meet the requirements of maintenance and production works. | The free diamond contained in the abrasive film momentarily settles in the hard material of the plate. When assembled they produce a CUTTING effect that achieves the STOCK REMOVAL. | In contact with the soft material of the plate the free diamond sinks while remaining mobile, it is the CHOCKING effect that contributes to the quality of the SURFACE CONDITION. | ||||
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| CERTIFIED | ||||||
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| ; f—11 r~~~j t idi—f r-~je | ISO 9001 VERSION 2000 | |||||
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