Thermal Management Solutions - LAIRD TECHNOLOGIES - #51

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GAP FILLERS

T-putty

TM

504 Product Data Table

PropertyT-putty

TM

504Test Method

Construction and CompositionCeramic-filled dispensable silicone gel- ColorLight Gray-Viscosity @
o C, mPa.s (cP) Brookfield RV, TC spindle, Helipath @ 0.05 rpm4.000.000- Temperature Range-45 to 200
o C- Outgassing TML0.34%ASTM E595 Outgassing CVCM0.09%ASTM E595 Thermal Conductivity1.8 W/mKASTM D5470 (modified) Thermal Impedance0.15
o C-in
2 /WASTM D5470 Final Thickness @ 0.010(0.97
o C-cm
2 /W)(modified)Thermal Impedance0.27
o C-in
2 /WASTM D5470 Final Thickness @ 0.020(1.74
o C-cm
2 /W)(modified) Dielectric Strength500 VAC/milASTM D149 Volume Resistivity>1014 ohm-cmASTM D257 MSDSDetails-Shelf LifeIndefinite-

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