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3.6V Bluetooth Module with Power Amplifier - LAIRD TECHNOLOGIES


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Laird Technologies Web site: www.LairdTech.com Item # BTM402, 3.6V Bluetooth Module with Power Amplifier 3.6V Bluetooth Module with Power Amplifier Long Range Bluetooth™ Serial Module The BISM II PA Bluetooth Serial Module is a fully integrated and qualified Class 1 Bluetooth solution, which incorporates a power amplifier and low noise amplifier that maximizes the RF link budget to provide the greatest range of any Bluetooth Module. The module is designed for lowest cost of integration and ownership for designers wishing to incorporate Bluetooth functionality into their products. The module is qualified to Bluetooth Version 2.0. The BISM II PA Bluetooth Serial Module is one of the most compact complete Bluetooth solutions, making it ideal to integrate into handheld devices. The module includes a high sensitivity, high gain antenna which provides excellent range. Typical open field performance provides ranges of up to 1,000 meters at transmit powers of 65mW. The BISM II PA Module is based on Cambridge Silicon Radio’s BlueCore 04 chipset. The module contain all of the hardware and firmware for a complete Bluetooth solution, requiring no further components. The Module has an integrated, high performance antenna which is matched with the Bluetooth RF and baseband circuitry. The firmware integrated into the BC04 chipset implements the higher layer Bluetooth protocol stack, with support for applications requiring Generic Access Profile (GAP), Service Discovery Profile (SDAP), Serial Port Profile (SPP), Dial Up Networking Profile (DUN), Headset Profile (HSP), Hands Free Profile (HFP), File Transfer Profile (FTP) and OBEX (Client). A virtual processor is used within the BC04 to implement an AT command processor. This interfaces to the host system over a straight forward serial port using an extensive range of AT commands. The AT command set abstracts the Bluetooth protocol from the host application, saving many months of programming and integration time. It provides extremely short integration times for data oriented cable replacement and voice applications. Firmware is also included that provides programming support for multi-point applications. A low cost development system is available for fast product evaluation and development. Support is provided for low power modes that make the BISM II PA particularly applicable to battery powered installations. The Module can be configured so that it can be attached to a 'dumb' terminal or attached to a PC or PDA for cable replacement applications. In addition to the Bluetooth functionality, The BISM II PA Module provides access to 7 General I/O lines and 2 analogue input lines. These can be configured to provide connection to simple devices such as switches or LEDs without requiring any external processor. Both the GPIO and ADC lines can be accessed either via the wired host UART connection, or remotely over the Bluetooth link. The BISM II PA module is supplied in a small form factor pcb (22.0 mm x 34.0 mm x 7.6 mm), that connects to a main pcb using a 40 way Hirose connector. The interface is compatible with the BISM1 module and Laird Technologies' 40 pin 802.11 modules. The BISM II PA module is Lead-free and is RoHS compliant and supports an industrial temperature range of -10°C to +85°C. A key feature of the design is that the module is pin and format compatible with Laird Technologies' range of 802.11 wireless LAN modules. This allows designers to manufacture a single version of pcb which can accept either a Bluetooth or an 802.11 module, greatly reducing development time to generate a range of wirelessly enabled products. The compatible 802.11 modules are the WISMC01, which contains a full TCP/IP stack, network drivers and a web server, and the WISMC02 which contains wireless network drivers and a UDP stack with SLIP interface. · SPECIFICATIONS · WIRELESS SPECIFICATION · ANTENNA MODES · UART INTERFACE · GENERAL PURPOSE INTERFACE · AUDIO · PROTOCOLS & FIRMWARE · COMMAND INTERFACE · CURRENT CONSUMPTION · SUPPLY VOLTAGE · COEXISTENCE / COMPATIBILITY · CONNECTIONS · PHYSICAL · ENVIRONMENTAL · APPROVALS · MISCELLANEOUS · DEVELOPMENT TOOLS · APPLICATIONS SPECIFICATIONS 6/22/2011 | Page 1 of 5

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