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| Computer-On-Modules | ||||||||||||||||||||||||||||||
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| v Computer-On-Modules microETXexpress™ -a COM Express solution for compact embedded systems | microETXexpress | |||||||||||||||||||||||||||||
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| CPU Clock Cache Chipset Bus Speed DRAM DRAM socket SM Bus Support Hard Disk USB USB Boot/Legacy Support Ethernet Ethernet Controller Audio Controller Graphics Controller Graphics Memory Flat Panel Interface Power Management 12V only supply Wide Range Support Power Consumption (typ.) Dimensions H x W x D PCI PCI Express | Intel® Pentium® M, Intel® Celeron® M, CM 600 MHz, 800 MHz, 1 GHz PM 1.4 GHz 600 MHz up to 1.4 GHz 512 kByte up to 1 MByte (L2 on chip) Intel® 855 GME / 852GME 400 MHz 1024 MByte (DDR-SDRAM) 1x DDR-SODIMM socket up to 1 GByte | Intel® Atom™ processor Z500 series 1.1 GHz up to 1.6 GHz 32 Kb Instruction Cache + 24 Kb L1 Cache 256/512KB L2 Cache Intel® System Controller Hub US15W 400/533 MHZ FSB Up to 1GB DDR2 1x DDR-SODIMM socket | ||||||||||||||||||||||||||||
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| 2x Serial ATA, RAID 0,1; 1x Parallel ATA USB 2.0, 6 ports 3/3 10/100 Base-Tx Intel® 82562 ET (integrated) AC97 Intel® Extreme Graphics 2 up to 64 MByte UMA CRT, JILI Interface (LVDS) ACPI, APM 1.2, S3 support | 2x Serial ATA, RAID 0,1; 1x Parallel ATA 6x USB 2.0 3/3 Up to 10/100/1000 MBit Ethernet Onboard Intel® 82574L Hartwell Intel® High Defi nition Audio Integrated Intel® Graphics HDTV/HD capable, Decoder for MPEG2(HD)/H.264 up to 256 MByte UMA SDVO, Single or dual-channel LVDS 18/24 Bit ACPI, APM 1.2, S3 support | |||||||||||||||||||||||||||||
| 3 3 8.5 V - 18 V 8.5 V - 18 V Typical: 13.5 W @ 1.0 GHz, 12 V 7W @ 12V 95 x 95 mm 95 x 95mm PCI 2.3, 32 bit / 33 MHz PCI 2.3, 32 bit / 33 MHz 2 PCI express x1 Lane, optional 5x1 Lane | ||||||||||||||||||||||||||||||
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| microETXexpress™ > Compatible with COM Express specification from PICMB, pin-out type 2 > Latest interface technologies v Available with PCI bus or PCI-Express® bus > Smaller compact module size > Future proof designs > Predestinated for mobile applications | offers full PCI Express or PCI support and all on the small available form factor. The microETXexpress™ performs comparably to ETX modules on a smaller footprint and has significantly farther reaching long-term prospects. | The Thermal Concept microETXexpress™ Heatspreader provides: v Identical mechanical size - all microETXexpress™ modules fit in the same system. v The only surface that needs cooling is the top of the heatspreader. | microETXexpress™ / COM Express™ Starter-Kit v Complete Starter-Kit for immediate evaluation purposes. v Includes all required hard- and software components for a quick start. v Choose your Module for the Starter-Kit. | |||||||||||||||||||||||||||
| microETXexpress™ is 100 percent compliant to the ETXexpress® form factor, which is COM Express (PICMG) conform, microETXexpress™ is the compact compatible module concept for the open Standard COM Express™ (by PICMG). The plug design and pinout are identical, only the size has been reduced. The compliant Computer-On-Module is equipped with state-of-the-art features. microETXexpress™ is the entry-level model for COM Express™ and | ||||||||||||||||||||||||||||||
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