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5. Electrical Characteristics

In most cases, the Electrical Characteristics are the same for both module and chip. They are described in detail in the chip datasheet. Where there are differences, they are detailed below.

5.1. Maximum Ratings

Exceeding these conditions will result in damage to the device. Parameter Min Max Device supply voltage VDD -0.3V 3.6V Voltage on analogue pins: ADC1-4, DAC1-2, COMP1-, COMP1+, COMP2-, COMP2+, DIO9, DIO10, SPISSM, SPISWP, SPICLK, SPIMOSI, SPIMISO, -0.3V VDD + 0.3V Voltage on 5v tolerant digital pins: SPISSZ, DIO0-DIO8, DIO11-DIO20, RESETN -0.3V Lower of (VDD2 + 2V) and 5.5V Storage temperature -40ºC 150ºC Reflow soldering temperature according to IPC/JEDEC J-STD-020C 260ºC This device is sensitive to ESD and should only be handled using ESD precautions. Temperature 25~160 ºC 160~190 ºC > 220º C 230~Pk. Pk. Temp (235ºC) Target Time (s) 90~130 30~60 20~50 10~15 160~270 Figure 2: Recommended solder reflow profile © Jennic 2008 JN-DS-JN5121MO-1v3.doc 9