L-530 Solution Coated Epoxy Prepreg - JDLincoln - #2

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Two-component adhesive, Epoxy adhesive, Adhesive, Prepreg


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Core: Aramid Phenolic, 3 lbs/ft
3 , 1/8” cell (16 kg/m
3 , 3.175 mm) Facings: 1 ply L-530-7781 each side RT FlatwiseTensile Strength:Core Failure RT Sandwich Peel Strength:15 in lb/in (67 N/25 mm) *Sandwich peel strength varies with orientation of fibers directly against the core and test direction. Fibers laid up parallel with the test direction produce minimum strengths. Fibers laid up perpendicular to the test direction produce maximum strengths.

L-530 Solution Coated Epoxy Prepreg - 54483 Mechanical Data Sandwich Properties*

PropertyVacuum PressureTest Method Ultimate Tensile Strength Room Temperature (RT) 61 KSI (421 MPa)ASTM D638 160°F(71°C)45 KSI (310 MPa)ASTM D638 RT after 1 Hour Water Boil57 KSI (393 MPa)ASTM D638 Tensile Modulus Room Temperature (RT) 3.5 MSI (24 GPa) ASTM D638 160°F(71°C)3.5 MSI (24 GPa) ASTM D638 RT (Wet) 3.5 MSI (24 GPa) ASTM D638 UltimateCompression Strength Room Temperature (RT) 68 KSI (469 MPa)ASTM D695 RT after 1 Hour Water Boil56 KSI (386 MPa)ASTM D695 Compression Modulus Room Temperature (RT) 3.5 MSI (24 GPa) ASTM D695 RT (Wet) 3.4 MSI (23 GPa) ASTM D695 Ultimate Flexural Strength Room Temperature (RT) 96 KSI (662 MPa)ASTM D790 160°F(71°C) after 30 Minute Soak @ 160°F74 KSI (510 MPa)ASTM D790 RT after 1 Hour Water Boil80 KSI (552 MPa)ASTM D790 RT after 30 day HydraulicFluid Soak78 KSI (538 MPa)ASTM D790 RT after 30 day JP-4 Fuel Soak 78 KSI (538 MPa)ASTM D790 Flexural Modulus Room Temperature (RT) 3.6 MSI (25 GPa) ASTM D790 160°F(71°C)3.5 MSI (24 GPa) ASTM D790
NOTICE: Product data and parameters cited in this publication have been obtained in J.D. Lincoln, Inc. laboratories using the materials under carefully controlled conditions. The information, therefore, is believed to be accurate and correctlystated. Data of this type maybe considered to be indicative of representative properties obtainable. J.D. Lincoln, Inc. cannot accept responsibility for the misapplication of these products, nor for their use under uncontrolled conditions. Numerical values resulting from the application of this material are dependant on processing details. It is recommended that the user develop his or her own application techniques and generate data consistent withhis or her specific application and process. L-530

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