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HiPerFETTM Power MOSFET
1 /4Pages

HiPerFETTM Power MOSFET

HiPerFETTM Power MOSFET
1 /4Pages

Catalog excerpts

HiPerFETTM Power MOSFET-1

© 2005 IXYS All rights reserved 1 - 4 VKM 60-01P1 515 ID25 = 75 A VDSS = 100 V RDSon = 25 mÙ trr < 200 ns HiPerFETTM Power MOSFET H-Bridge Topology in ECO-PAC 2 N-Channel Enhancement Mode High dv/dt, Low trr, HDMOSTM Family MOSFETs Symbol Conditions Maximum Ratings VDSS TJ = 25°C to 150°C 100 V VDGR TJ = 25°C to 150°C; RGS = 1 MÙ 100 V VGS Continuous ±20 V VGSM Transient ±30 V ID25 TC = 25°C 75 A IDM TC = 25°C, pulse width limited by TJM 300 A IAR TC = 25°C 75 A EAR TC = 25°C 30 mJ dv/dt IS IDM, di/dt 100 A/ìs, VDD VDSS, 5 V/ns TJ 150°C, RG = 2 Ù PD TC = 25°C 300 W Symbol Conditions Characteristic Values (TJ = 25°C, unless otherwise specified) min. typ. max. VDSS VGS = 0 V, ID = 250 ìA 100 V VGS(th) VDS = VGS, ID = 4 mA 2.0 4 V IGSS VGS = ±20 VDC, VDS = 0 ±100 nA IDSS VDS = 0.8 • VDSS; TJ = 25°C 250 ìA VGS = 0 V; TJ = 125°C 1 mA RDS(on) VGS = 10 V, ID = 0.5 ID25 25 mÙ Pulse test, t < 300 ìs, duty cycle d < 2% gfs VDS = 10 V; ID = ID25, pulse test 25 30 S Ciss 4500 pF Coss VGS = 0 V, VDS = 25 V, f = 1 MHz 1600 pF Crss 800 pF td(on) 20 30 ns tr VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25 60 110 ns td(off) RG = 2 Ù, (External) 80 110 ns tf 60 90 ns Qg(on) 180 260 nC Qgs VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25 36 70 nC Qgd 85 160 nC RthJC 0.5 K/W RthCK with heatsink compound (0.42 K/m.K; 50 ìm) 0.25 K/W Features • HiPerFETTM technology - low RDSon - low gate charge for high frequency operation - unclamped inductive switching (UIS) capability - dv/dt ruggedness - fast intrinsic reverse diode • ECO-PAC 2 package - isolated back surface - enlarged creepage towards heatsink - application friendly pinout - low inductive current path - high reliability - solderable pins for PCB mounting Applications • drives and power supplies • battery or fuel cell powered • automotive, industrial vehicle etc. • secondary side of mains power supplies IXYS reserves the right to change limits, test conditions and dimensions. Pin arangement see outlines L 4 L 9 P 18 R 18 X 15 T 18 V 18 A1 E10 F10 K10 K 12 K 13 NTC L 6 X 18

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HiPerFETTM Power MOSFET-2

© 2005 IXYS All rights reserved 2 - 4 VKM 60-01P1 515 Module Symbol Conditions Maximum Ratings TVJ -40...+150 °C Tstg -40...+125 °C VISOL IISOL 1 mA; 50/60 Hz; t = 1 s 3600 V~ Md mounting torque (M4) 1.5 - 2.0 Nm 14 - 18 lb.in. a Max. allowable acceleration 50 m/s2 Symbol Conditions Characteristic Values min. typ. max. dS Creepage distance on surface (Pin to heatsink) 11.2 mm dA Strike distance in air (Pin to heatsink) 11.2 mm Weight 24 g Source-Drain Diode Characteristic Values (TJ = 25°C, unless otherwise specified) Symbol Conditions min. typ. max. IS VGS = 0 V 75 A ISM Repetitive; 300 A VSD...

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.