Applied Materials Mirra Mesa TX5344 - ITW Texwipe - #1

/ 1


catalogue search
Applied Materials Mirra Mesa TX5344 - ITW Texwipe
P. 01
Page:
Applied Materials Mirra Mesa TX5344 - ITW Texwipe


See other catalogues for ITW Texwipe
You may also be interested in

Acrylic adhesive tape, Mat, Brush, Cleaning brush, Adhesive tape


Text version of the page
ITW TEXWIPE
Description
ITW Texwipe offers a broad variety of HydroCell® PVA-based products for substrate cleaning in the semiconductor and rigid disk industries. Our experience in providing critical contamination control products for these industries has enabled us to develop a family of superbly clean, highly durable, precision PVA brushes for removing process contaminants from wafers and disk media.
TX5344
HydroCell Nodule Brush
Quality
ITW Texwipe has consistently set the standard in the use of test methods to ensure the quality, cleanliness and consistency of the products it manufactures for contamination control and critical cleaning. We bring that expertise to our PVA brushes with our unique Test Method 17: Physical Properties of Open-Cell Foam Roller Brushes. ITW Texwipe also performs chromotography testing to verify and ensure that the cleanliness of its PVA brushes conform to strict specifications. These test results have been verified by an independent testing lab.
Outer Dia. = 70 mm Inner Dia. = 32 mm Length = 216 mm
Features
■ 100% synthetic polyvinyl acetal (PVA) construction
■ Precision cast and cut
^ Noncontaminating sterilant to control bacterial growth
^ Full lot traceability
^ Xclean™processed
^ Sterilized with l-LO2or E-Beam
^ Packaged in an ISO Class 5 cleanroom
Benefits
^ Consistent fit and function
^ ISO-certified converting facilities with strict quality
assurance protocols ^ Xclean® processing for minimal ions and extractable residues ^ Testing of eight physical parameters; apparent density, effective
porosity, absorption capacity and speed, pore size, 30%
compression, tensile strength and elongation
■ O.EM. tested
Applications
 Media cleaning
 Post-CMP process cleaning
 Prime silicon wafer cleaning
For more information, visit our website at www.texwipe.com
Performance Characteristics
Property Typical Value Test Method*
Apparent Density 0. 12g/cm;
! TM17
Effective Porosity 89%
TM17
Equivalent Pore 528 urn Diameter
TM17
30% Compressive 71.5 g/cm Strength
i2 TM17
Tensile Strength at Break
Eongation 608.9% TM17 Strength 5.7 kg/cm2 TM17
Absorption (DIW) Capacity 852% TM17 Speed 13.2 sec/cm TM17
Chemical Resistance at Ambient Temperature
Acetic Acid < 3%
Hydrogen Peroxide <5%
Acetone <20%
Isopropanol <8%
Alkali <5%
Methanol <20%
Ammonium Hydroxide < 10%
Methyl Ethyl Ketone (MBK <10%
Benzene**
Phosphoric Acid <5%
Citric Acid <10%
Sodium Hydroxide <3%
EDTA <10%
Sulfuric Acid <5%
Ethanol <10%
Tetrahydrofuran - Not Suitable
Ethers** - Suitable
Tetramethylammonium Hydroxide <2%
Ethyl Acetate**
Toluene**
Freon**
Trichloroethane**
Hydrochloric Acid <2%
Xylene - Not Suitable
Hydrofluoric Acid <5%
#™Texwipe*
North America
300B Route 17 South
Mahwah, NJ 074 30
Tel (800) TEXWIPE ext 120
Europe/Middle East
Skejby Nordlandsvej 307 DK-8200 Aarhus N Denmark
Asia/Pacific
50 Tagore Lane #02-01 Markono Distri Centre Singapore 787494 Tel +65 6468 9433 Fax+65 6468 6772
Note: The data in this table represent typical analyses of these brushes at the time of publication. These are not specifications. ITW Texwipe continually refines both its processes and its products.
* ITW Texwipe Test Method 17 is available on our website at www.texwipe.com.
** Will not attack PVA but is not compatible with wet PVA due to immiscibility with water.
(201) 684-1800 ext 120 Tel +45 87 400220 Fax (201) 684-1801 Fax+45 87 400 222
www.texwipe.com info@texwipe.com
DS-5344 ©2007 ITW Texwipe Printed In USA Effective: May 2007

pageCatalog pdf di En 2012-05-22-30