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| APEX ™ High Speed Slot Die | ||||||||||||
| The Dynatec Advantage | ||||||||||||
| ■ Slot die design does not require micro adjustments to achieve the required adhesive lay down weights. ■ APEX™ SB module with recirculation provides a clean adhesive cutoff regardless of the adhesive pattern. | ||||||||||||
| Precise high speed intermittent adhesive patterns. Self-cleaning die lips permits the use of a variety of adhesive viscosities. Exceptional value for a high speed slot die applicator. | ||||||||||||
| Dynatec™ Adhesive Application Solutions | ||||||||||||