Thermal and Mechanical Considerations for Full-Pak Applications - International Rectifier - (Version JPG) - PDF Catalogue | Technical Documentation



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AN-972B Thermal and Mechanical Considérations For FullPak Applications (HEXFET is a frademarA of International Rectifier) by Peter Wood, Donald A. Daakus II

Plastic Packages *Plastic molded semiconductors have bccn available for décades and tuve becomc lie* preferrei! packages for ail commercial and incustrial equipmeni. The** mon popular nouer paikage by far is [hc TO-220AB. but reccntly, as higher pouer lequiremcnis have emerged. the TO-247AC lias saincd popularily. While boih of thèse packages have excellent thermal charactcristics, tbey are non-isolated and in mon instances nced to be isolated from the groundcd irjniEn.ii k nf [he equipment thaï uses them. Thrcc meihods for providing electrical iiolation are 1. Isolated heatsini inside the grounded enclosuie, 2. Insulaiing mica or plastic film mounting m grounded heatsini, or 3. Elastomcric thermally conductive insulation material such as Sil-Pad' manufactured by The BerpJuiir Company. Ail meihods raise the System cost and additionally cause EMI/RF1 problems due to the capacitance te Brouné ol :hc isolation scheme. Whenevci ,in addiiiitmil roriiiiiutsm Midi as amountinu. huilai ri- n jsed, thcrcis a conséquent rcducuon m ;ys:c-r rcliability, espccially if Ihere isa high voltage across the insulalor. A need for (elf isolated TO-220 and TO-247 packages i> cleariy mdicated. The requircmenls for such packages 1. Same physical outlinc as ihe TO-247 or TO-220. 2. Same pin spadng and pinoui as the TO-247 or TO-220.		3. Same mounting holc dimensions as the TO-247 or TO-220. 4. Similar thermal charactcristics to non-isolaied version wiih insulaiing hardware. ï. Minimum capacitance to mounting sur l'ace. 6. Adéquate creepj).y <J:st j:ni:s pin lu-lieatsink lo meet current safety codes (UL, CSA. VDE, etc.). 7. Maximum corona-free isoiaiion voilage. International Rectifier FullPaks Carelul considération of the aforementioned requiremenis for boih the TO-220 and TO-H7 fully isolated plastic packages led ta the International Rectifier FullPak case styles manufactured to the outline diagrams shown in Figures 1 through 4. International Rectifie! FullPak HEXFET power MOSFET déviées are identified by the letter "I" which is added to the standard pan number immediately following the "IRF" portion of th( part number. For example, the standard TO-220 device, IRFZ44. becomes IRF1Z44G in the FullPak package: ihe standard TO-247 device, 1RFP054. becomes IRFTP054. As show-n above. the TO-220 FullPak part numbers end in the leiter "Q". Tbisisa rnanufac'.ur.^ç. t. nie. :( cesijn.uss thaï Ihedevice wu packaged ai IR tireat Brilain Figura 5 and € describe the varions marking on both FullPak devices. Thermal Cfiaracteristlcs As v.ith non-isalatcd devices. thermal rcsi j.ancL- Irum the scmiconducior die tu ih; surface ol tli; package is inversely proportional to the area ol the die and directly proponional to the sum of the coroponents of thermal résistance uithin the package. The picture is further complicated by the amnutti cl hea: spreading thaï lakes place wilhin the header on which the die is moumed.

Thermal and Mechanical Considerations for Full-Pak Applications - International Rectifier - #1

MOSFET array, Filter, Schottky diode, Solid-state switch, Bridge