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ANSYS
®
Icechip
®
11.0 RELEASE
Product Features
ANSYS
® Icechip
® software allows you to accurately characterize package duringdesign —saving time, money and headaches that result from discovering thermal
problems late in the design cycle.ANSYS Icechip provides far more than temperature predictions typical of other thermal analysis tools. It actually helps build thermal optimization into the design, no matter what package style you are designing.Developed for use by both non-thermal and thermal analysts, the
ANSYS Icechip direct interface
with industry-recognized package
design tools delivers fast, accu-
rate results, ensuring the best
possible thermal design.
ECADinterfaces Cadence APD Sigrity UPD Package Types Ball grid array Package-on-package System-in-package Leaded Stacked die Multi-chip modules Flip chip Wire bond MCAD Interface through DXF/DWG Files
Thermal Environment Practically any package type ECAD Data Imported Complete ball grid array substrate?All traces
?All types of vias ?Dielectric and metal layers
?Solderballs ?Bond wires ?Chips ?Encapsulant
Improves accuracy: Launch
ANSYS Icechip from within Cadence
® APD or Sigrity
® UPDto capture real device geometry automatically.
Complex geometry, such as a lead frame, is exactlyrepresented in the ANSYS Icechip 3-D model.
Reduces time to market: ANSYS Icechip integrates thermal simulation into the system design and verification process.
Natural or forced convection; define a heat transfer coefficient or have ANSYS Icechip calculate
Solid long-term investment: ANSYS Icechip handles today’s package styles as well as the high heat-generating designs of tomorrow.
Radiation Fixed-temperature boundary conditions Simulate standard JEDEC thermal, tests
Who Can Use ANSYSIcechip Customer confidence: The ANSYS Icechip library of standard JEDEC boards and multiple case studies capability means packages can be characterized based on customers’real world conditions. Electrical and packaging engineers: designed so you don’t need a strong thermal background Thermal engineers: generates accurate thermal
models and provides the flexibility to solve thermal problems
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