KMC - Hypertac Interconnect - #1

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KM Series MARCH 2008 37 Technical Characteristics High Density PCB Connectors ESA/ESCC 3401/039 NF C-UTE C 93-424 · Equipped with 0.50mm contacts · High density interconnection · Up to 162 signal contacts / 3 rows · 1.905mm between rows · 1.27 mm between contacts quincuncial · Low contact insertion · Low contact resistance · Polarization by guiding or locking devices · 5000 mating and unmating cycles MATERIALS Moulding Glass fiber filled diallyl - phtalate Contacts Brass or bronze Guides - coding styles - screws Stainless steel or nickel plated brass or ARCAP PLATING Standard ESA Pin 0.25ìm Gold/1.27ìm Ni 1.27ìm Gold/1.27ìm Ni (min) Socket body 0.25ìm Gold/1.27ìm Ni on activ area 0.25ìm Gold/1.27ìm Ni (min) 1.27ìm Ni on non activ area Socket wires 1ìm Gold/0.20ìm Ni 1.27ìm Gold/0.20ìm Ni (min) Guides (brass) Ni Ni DIELECTRIC WITHSTANDING VOLTAGE 800Vrms CURRENT RATING (at 25 °C) 3A Max (25°C) INSULATION RESISTANCE > 104MÙ (500Vcc) CONTACT RESISTANCE  8mÙ TEMPERATURE RANGE -55°C, +125°C CONTACTS HYPERTAC® type Ø 0.50mm PITCH 1.905mm between rows 1.27mm between quicuncial contacts GUIDING By two outside guides (2 guiding styles) and one central guide (3 guiding styles) KEYING By rotating of outside polarised guides (Up to16 keyings) MASS & POWER CONTACTS HYPERTAC® type can be used instead of outside guides