CMD/CSD - Hypertac Interconnect - #1

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CMD Series Contact Number Contact Diameter Current Rating Contact Resistance Engagement/ Withdrawal Forces Contact Life Cycle Dielectric Withstanding Voltage Temperature Range Insulation Resistance Insulator Contact - Material - Plating Hardware Plating Reference 42, 82, 110, 126, 158, 174, 220, 236, 316 0.6 mm nominal pin DIA 3A 5.0 mÙ maximum individual 0.6 N nominal per contact 30.000 insertion and withdrawal cycles 750 VRMS, 60 Hz - sea level -65 °C to +125 °C >5x103 MÙ at 500 V dc - thermoplastic according to MIL-M-24519 Type GST 40 F; V-0/5VA per UL 94 - ESA SCC 3401 Outgassing requirements compliance Brass & BeCu Gold Plate stainless steel passivated or beryllium-copper alloy nickel plated according to MIL-DTL-55302 requirements APRIL 2005 153 4 Contact Row High Density Signal Connectors • Offset-grid contact layout, four contact rows within dielectric connector body, 1.905 mm center-to-center contact spacing in each row and 1.905 row-to-row spacing. • 0.6 mm nominal pin DIA contact size; 42 to 316 contact positions; dip solder and SMT soldering contact termination types. • High contact density, low connector weight, low mating force. High shock and vibration proof (no micro interruptions - test: 2ns). • Conforms to MIL-DTL-55302 general requirements, and TPR 02013. CSD conforms to ESA specification. • For Civil, Military, Aerospace and Space applications. Technical Characteristics