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HexPly

®

M65

Toughened Bismaleimide Resin for Advanced Composites

BMI M65 - 37685 Product Data

Description

HexPly
® M65 is a bismaleimide resin that cures via an addition reaction in a toughened two-phase thermosetmatrix with no condensation by-products. HexPly
® M65 is a controlled flow polyimide resin system designed for alternative processing capabilities such as co-curing over honeycomb core, compression molding, as well as standard autoclave processing. HexPly
® M65 has improved tack levels and performs well for fiber placement applications.

Features

Uncured Cured â–  Controlled Flow â–  High Laminate Mechanical Strengths and Strains â–  Process Working Life Greater Than 20 Days â–  High Strength Retention at 450°F (232°C) Dry and 350°F (177°C) Wet â–  Enhanced Tack â–  Good for Fiber Placement Applications â–  Improved Compression After Impact Properties â–  Good Tack Life to 10 Days â–  Void-Free Thick Laminate Processability â–  Void-Free Thick Laminate Co-Cure Processing Over Honeycomb Core â–  Long-term Service Life to 400°F (204°C) â–  Excellent Electrical Properties

Neat Resin Properties

Specific Gravity1.246T
g dry*572°F (300°C)T
g wet*437°F (225°C)Equilibrium Moisture Absorption3.8%Fracture Toughness, K1C880 psi - in
1/2 (0.967 MPa - m
1/2 ) Dynamic Viscosity Analysis
10 9 10 8 10 7 10 6 10 5 * Test method: DMTA, N* – CPS E" peak 10 4 3 10 2 080(27)120(49)160(71)200(93) 40(4)10 280(138)320(160)360(182)400(204)440(227) Temperature – ËšF (ËšC)
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