Precision
·1 µm at 3 o axis repeatability at an interpolatedencoder resultuion of 20 nm
Largest Bonding Area
·305 mm x 410 mm (12" x 16.1") work area can serve as two or more smaller stations for efficient handling of smaller productsor substrates, eliminating index time and maximizing throughput·Enables intelligent automation of extra large products
Speed
·Up to 7 wires per second
Quality
·Consistant performance for the highest yields
·Realtime bond quality
industrial monitoring system·Wear- and maintenance free piezo bondheadwith solid state
industrial hinges·Software supports control by host computer, product traceabilityand external statistical analysis
Small footprint,big capability
BONDJET BJ820
·Integrates easily into complexproduction lines
In real mass volume productionof a complex COG chip on glass
application, the BJ820 bonds morethan 5 wires per second with awire length over 2 mm. Thesebonds fulfill all visual demandsand have consistent outstandingpull values.
High Speed Fully AutomaticWedge Bonder
The Bondjet BJ820 is the latest developmentof Hesse & Knipps' wedge bonding innovation,handling all challenging wire bonding applica-
tions on a single platform – RF and microwave
devices, COB, MCM and hybrids, fiberopticsand automotive using aluminium or gold wireor ribbon.
89° Deep AccessBondhead
45° Wire FeedAngle Bondhead