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Fully Automatic Multichip Ultrasonic Flipchip-Bonder

Innovative process

Ultrasonic method for bonding gold-stud-bumps

Speed

Cycle time about 1.0 - 1.2 s (without process time)

Accuracy

+/- 5 µm positioning accuracy +/- 3 µm repeated accuracy

Flexibility

Chipsize: 0.2 x 0.2 mm ² up to 12 x 12 mm² Multichip for chips with similar size (same bond tool, same type of bondhead) Wafer: 4’’- 8’’ (optional up to 12’’) 4’’ Chiptray

Flipjet FJ520 - 22800 Flipjet FJ520

Ultrasonic Flipchip-Bonder

Process Advantages

No reflow process required Mono-metallic connection, fine pitch down to 20 µm possible

The Flipjet FJ520 is the latest innovation of Hesse & Knipps GmbH. The long-term experi- ence in ultrasonic technology guarantees opti- mal solutions for your bonding processes. Es- pecially in those applications that require high functionality on smallest space the FJ520 offers great advantages.

No underfill required for some applications

Intelligent process control

Deformation control

Substrates

Reel to reel Foil Ceramic FR4