BONDJET BJ939 HEAVY WIRE BONDER - Hesse & Knipps - #1

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HESSEêKNIPPS Semiconductor Equipment New Benchmark for Heavy Wire Bonders Advanced Features and Process Advantages E-Box: patentée! solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge Maintenance-free solid state joints Closed loop force control programmable, wire: from 0 cN up to 1400 cN ribbon: from 0 cN up to 4000 cN Touchdown and déformation sensor without signal delay Active cutting bondhead •* Accurate positioning of the cutter and therefore repeatable precize and programmable cutting depth »• Better access into tight packages as no pusher is needed Extended cutter lifetime Quality Quality monitoring by high resolution déformation and transducer current and ultrasonic frequency measurement Integrated, non-destructive pull test, wire up to 450 cN, ribbon up to 1000 cN Quality test, free programmable for each wire Process integrated Quality Control (PiQC) for advanced quality monitoring in real time (patented) Speed BONDJET BJ939 HEAVY WIRE BONDER The Hesse & Knipps GmbH as technology leader has designed the only heavy wire bondhead with non destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time. Further outstanding features are high speed and the largest bonding area. Advanced features available only on BONDJET BJ939 are designed to meet your présent and future requirements and greatly enhance productivity. Up to 3 wires/s Accuracy 2 um at 3 a repeatability at each position in the large work area 3 um at 1/3 px pattern récognition System accuracy Largest Bonding Area •> 350 mm x 500 mm (1 3.8" x 1 9.7") Single- or multi-lane handlers for high inline flexibility