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BONDJET BJ915L - Hesse & Knipps


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Wire bonder, Monitoring software, Software, Die bonder


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Advanced Leadframe Production

E-box: Patented solution for optimum calibration of the bond wedge and free programmable tolerance ranges for cutter, guide and wedge High resolution quality control of wire deformation and transducer current Program upload and download via LAN Full automatic leadframe indexer

Integrated non-destructive Pull and/or Shear Test

Integrated non-destructible shear and/or pull test freely programmable for every wire Shear test for low stress on the wire

Speed

450 - 650ms
(depending on application)

Accuracy

10µm at 3 σ repeat accuracy at every position within the working area 7µm pattern recognition system accuracy

BONDJET BJ915L - 22800 BONDJET BJ915L

Bondhead Highlights

Maintenance-free solid state joints

for Leadframe Applications

Active cutting bondhead with improved cutter lifetime No pusher provides better access into tight packages Close loop force control, programmable from 0 to 1400cN

Hesse & Knipps is the only supplier in the mar-ket who has designed a Leadframe Bonder with integrated pull- and shear test. The modular design of the Leadframe indexer with the op- tion to link it to a multiple head system and the optional additional camera for faster pattern recognition qualify this bonder ideally for the Leadframe market.

Touchdown and deformation sensor without signal delay

pageCatalog pdf di En 2012-05-20-17