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Wire bonder, Monitoring software, Software, Die bonder
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Advanced Leadframe ProductionE-box: Patented solution for optimum calibration of the bond wedge and free programmable tolerance ranges for cutter, guide and wedge High resolution quality control of wire deformation and transducer current Program upload and download via LAN Full automatic leadframe indexerIntegrated non-destructive Pull and/or Shear TestIntegrated non-destructible shear and/or pull test freely programmable for every wire Shear test for low stress on the wireSpeed450 - 650ms(depending on application) Accuracy10µm at 3 σ repeat accuracy at every position within the working area 7µm pattern recognition system accuracyBONDJET BJ915L - 22800 BONDJET BJ915LBondhead HighlightsMaintenance-free solid state jointsfor Leadframe ApplicationsActive cutting bondhead with improved cutter lifetime No pusher provides better access into tight packages Close loop force control, programmable from 0 to 1400cNHesse & Knipps is the only supplier in the mar-ket who has designed a Leadframe Bonder with integrated pull- and shear test. The modular design of the Leadframe indexer with the op- tion to link it to a multiple head system and the optional additional camera for faster pattern recognition qualify this bonder ideally for the Leadframe market.Touchdown and deformation sensor without signal delay |
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