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High Speed, Fine Pitch Wedge Bonder

Precision k
1 µm at 3 axis repeatability k
High precision touchdown detection without time delay k
Precise control of bond force (1 cN) Flexibility k
Largest bonding area: 305 mm x 410 mm (12" x 16.1") k
Can serve with two or more smaller bonding stations forefficient handling of smaller products or substrates, eliminating indexing time and maximizing throughput (with indexers as well as with manual loading) k
Enables intelligent automation of extra large products Speed k k
Up to 7 wires per second Quality
Consistent performance for the highest yields k
Realtime bond quality monitoring system k
Wear free and almost maintenance free piezo bondheadwith solid state hinges

BONDJET BJ820 - 22800 BONDJET BJ820

k
Software supports control by host computer, product traceability and external statistical analysis

HIGH SPEED FULLY AUTOMATICWEDGE BONDER

Small Footprint, Big Capability k k
Integrates easily into complex production lines Process Advantages
The BONDJET BJ820 is an innovation of theHesse & Knipps GmbH for the thin wire wedge bonding market. All challenging wire bonding applications can be handled on a single plat- form – RF and microwave devices, COB, MCM and hybrids, fiberoptics and automotive using aluminium or gold wire or ribbon. Loop length: 70 µm up to 20 mm k
Various loop form functions k
Constant wire length k
Constant loop height k
Individual loop shapes k
Fine pitch capability: < 40 µm