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| | | ■ CD CO u n C | | |
| | | Non-contact Measurement (Image Measurement) | | |
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| | | OMeasurement Unit C8840 | | |
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| | | Hamamatsu also offers image processing and image measurement units. | | |
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| | | ■ Measurement Unit C8840 Series | | |
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| | | The C8840 can measures automatically the size (width and length), position and area of objects in real time combined with a video industrial camera just by turning the power on. With high measurement resolution and high speed measurement, the C8840 is well suited for work that requires precision and speed such as inspection and sorting on production lines. | | |
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| | | Devices for non-contact measurement in a short time of the 3-dimensional measurement of a body (entire body). These devices have many varied potential applications such as automated measurement of order-made industrial clothing for the garment industry, medical treatment such as plastic surgery and applications in sports gyms and beauty salons, etc. | | |
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| | | ■ Bodyline Scanner | | |
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| | | The Bodyline Scanner measures the 3-dlmensional measurement of the subject's entire body in a mere 5 seconds. Using an optical triangulation method allows making measurements without actually coming in contact with the body. (Takes about 10 seconds for high image resolution measurements.) | | |
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| | | ■ Bodyline Manager | | |
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| | | •Measurement principle Employs triangulation measurement method using 4 sensor heads. Measures entire body by vertically moving the sensor heads from top to bottom. | | |
| | | «:i Subject | | |
| | | This is software for automatically measuring landmarks needed for acquiring measurements for order-made clothing. (Measurement points: 47 points/62 sections in Ver. 1.3) | | |
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| | | Non-contact Measurement (Thickness) | | |
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| | | •Example of in-situ monitoring (under wet etching) | | |
| | | Devices that optically measure the thickness of a sample under test, with high precision without touching and harming the sample. | | |
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| | | 2500 | | |
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| | | 400 | | |
| | | 2000 I £ 1500 I 1000 I 500 0 | | |
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| | | I ET | | |
| | | ■ Optical MicroGauge C8125-01 | | |
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| | | 300 | | |
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| | | The C8125-01 measures the thickness of the sample by irradiating it with a near-infrared laser beam and then analyzing the reflected light. Measures film, glass and semiconductor wafers, etc. | | |
| | | 200 | | |
| | | P2 | | |
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| | | 0 100 200 300 400 500 | | |
| | | 0 200 400 600 800 1000 1200 Intensity (count) | | |
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| | | •Measurement of wafer thickness distribution (Thickness distribution: 70 um to 76 um) | | |
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| | | Sample: 8-inch silicon bare wafer with protective film (after grinding process) | | |
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| | | 9 | | |
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