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PDS-SE 70-5-0307 1
SE 70
Low Temperature Cure High Toughness
Epoxy Prepreg System
n Low temperature 70°C curing
n Faster cycle times at elevated temperature
n Excellent balance of mechanical properties and toughness
n Long outlife - up to 4 weeks @ 18-22°C
n Range of compatible adhesive films and ancillary products
n Excellent surface finish
n Good Tg
n Suitable for vacuum bag, press or autoclave consolidation
Introduction
SP-High Modulus’ SE 70 is a hot melt, low temperature cure, epoxy
prepreg system. It has been developed for
use in the construction of large components using low energy cure cycles. Excellent properties can be achieved
with a processing temperature of just 70°C. At this cure temperature the system exhibits very good mechanical
properties and excellent toughness.
Cure temperature for a 16 hours cure cycle is 70°C - this temperature allows less expensive tooling and ovens to
be used, with lower thermal movement and distortion. Faster cures are available from higher cure temperatures.
However, thicker sections (>10mm) will require the insertion of a suitable dwell into the cure cycle. Up to 20mm
thick laminates may be moulded at 70°C with a peak exotherm only slightly above the cure temperature.
