| Chapter 1 Outline .........................................................................................................................1 1.1 What is I RAM?......................................................................................................................................2 1.2 History of I RAM ...................................................................................................................................2 1.3 Comparison between FRAM and other Memories.................................................................................2 1.4 FRAM Structure and Ferroelectric Thin Film Materials........................................................................4 Chapter 2 Technical Explanation .................................................................................................5 2.1 Cell Structure of FRAM .........................................................................................................................6 2.2 Ferroelectric Materials ...........................................................................................................................7 2.3 FRAM Process Flow (Combination with CMOS Process) ....................................................................9 2.4 Cell Operating Principles .......................................................................................................................9 2.5 Writing and Reading Cell Data ............................................................................................................12 2.6 Reliability of Ferroelectrics..................................................................................................................14 Chapter 3 Introduction to Fujitsu FRAM Products......................................................................15 3.1 FRAM Standalone Memory .................................................................................................................16 3.2 FRAM Embedded Secure Processor ....................................................................................................17 3.3 FRAM embedded LSI for Smart Cards................................................................................................18 3.4 LSI for Rfid tags.................................................................................................................................18 3.5 FRAM embedded Custom ICs .............................................................................................................19 Chapter 4 Applications ...............................................................................................................21 4.1 What are Contactless Smart Cards? ..................................................................................................... 22 4.2 About Electric Power Transfer and RF Technologies..........................................................................22 4.3 Reader/Writer .......................................................................................................................................25 4.4 Contactless Smart Card Market............................................................................................................25 4.5 About Battery Backup ..........................................................................................................................26 Chapter 5 Security Technology..................................................................................................27 5.1 Security ................................................................................................................................................. 28 5.2 Elliptic Curve Cryptography and RSA cryptography ..........................................................................29 Chapter 6 Customer Support .....................................................................................................31 6.1 Firmware Development Support ..........................................................................................................32 6.2 Chip Supply .......................................................................................................................................... 32 6.3 COT Support ........................................................................................................................................ 33 6.4 Wafer manufacturing service ...............................................................................................................34 Chapter 7 Greening FRAM ........................................................................................................37 7.1 Introduction........................................................................................................................................... 38 7.2 Fujitsu's Group Guideline for the restriction of environmentally hazardous substances ....................38 7.3 Implementation of lead-free FRAM.....................................................................................................43 7.4 Subsequent approaches.........................................................................................................................46 References .................................................................................................................................................. 46 |