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| | 100 [im Bond Pad P - Anode | |
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| | Location mark Diameter = 30um | |
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| | 270±1 Opm Plan View Figure 3. Mechanical drawing of the VCSEL chip. | | |
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| | RVM665T (Preliminary) Revision P3 Firecomms assumes no responsibility for inaccuracies or omissions in the information contained in this document. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. | |
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