665 nm Multimode VCSEL - Firecomms - #4

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Text version of the page
KVMbbDl
Page 4
MECHANICAL
SPECIFICATIONS AND
ELECTRICAL CONNECTIONS
MECHANICAL
DIMENSIONS
Parameter
Symbol
Value
Tolerance
Units
Die Size
L x W
270 x 200
±10
urn
Die Thickness
T
200
±15
urn
Bond Pad Diameter
D
100
30 luti
±1
um
100 [im Bond Pad P - Anode
n - contact
p - contact
Location mark Diameter = 30um
270±1 Opm
Plan View
Figure 3. Mechanical drawing of the VCSEL chip.
Side View
RVM665T (Preliminary) Revision P3
Firecomms assumes no responsibility for inaccuracies or omissions in the information contained in this document. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein.

pageCatalog pdf di En 2012-02-07-14