HCI™ CONNECTOR SYSTEM TECHNICAL INFORMATION

PowerSupplySolutions Housing•Glass-filled High Temperature Nylon •Color: Black •UL 94 V-0 CompliantContacts•Power contacts: High Performance Copper Alloy •Signal pins: Phosphor-Bronze •Signal Receptacle contacts: Beryllium CopperPower Contact Plating•Separable Interface: Min 0.76 µm Au Over Nickel •Solder tail: Min. 0.5 µm Sn (Mating Tin) Over NickelSignal Contact Plating•Separable Interface: Min 0.76 µm Au Over 1.27 µmNi On the contact Area•Solder tail: Min. 2.54 µm Sn Over 1.27 µm Ni Mating Force: The force to mate a receptacle connector and compatible header shall not exceed 36.5 ounces per power contact and 3.5 ounces per signal contact. Withdrawal Force: The withdrawal force shall not be less than 26 ounces per power contact and 0.64 ounces per signal contact.

TECHNICAL DOCUMENTS

Product Specification•GS-12-380 (Preliminary) •BUS-12-090 (HPC Product specification)Application Specification•GS-20-070 (Draft)

ELECTRICAL PERFORMANCE MECHANICAL PERFORMANCE APPROVALS AND CERTIFICATIONS

Current Rating •52 Amps – 10 contacts fully energized at 30°Ctemperature rise in still air •85 Amps – 1 contact fully energized at 30°Ctemperature rise in still air UL-1977, CSA – 95 Amps per contacts with 10 contacts energized in still air

PACKAGING SPECIFICATION NUMBER

GS-14-1073

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9 MATERIALS