PART NUMBER

5 7 Lead 2 Plating Pin Style PositionsPer Row Packaging LF

1 = Through Mount (TMT) G =0,76 µm (30µ") Gold on mating area,2-6 µm (79-237µ") Tin on solder side 2 =Surface Mount (SMT) 02 to 25 (TMT) = Tube without cap (TMT) F =Gold flash on mating area,2-6 µm (79-237µ") Tin on solder side 02 to 25 (SMT) A = Tape-and-reel with cap (SMT) Surface MountPinMating side Through MountPinMating SideSolder SideOAL Stylemm Stylemmmmmm 51 2.00 06 4.002.508.00 52 4.00 08 4.003.008.50 57202 52 XXALF 57202 52 Positions per row ALF XX = 02, 03, 04, 05, 06, 08, 10

Recommended PCB Layout

2.00 mm(.079") Dimensions in mm Technical / Application Support / Drawings / Specifications / Samples: www.fciconnect.com/basics

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