| FEATURES A full set of building blocks for backplane, co-planar, industrial mezzanine, and cable-to-board applications in Hard Metric building practices Innovative edge-coupling technology and air dielectric between adjacent conductors deliver lowest insertion loss and crosstalk High-speed serial data rates can scale from 2.5 Gb/s to beyond 12 Gb/s without requiring redesign of a basic platform Opposed dual-beam receptacle contact structure provides high reliability Contains no interleaving shields reducing connector weight, cost, and PCB routing complexity Allows for allocation of differential or single-ended signals or power within the same signal module connector Co-planar modules are available with 15 contacts (5 differential pairs), 12 contacts (4 pairs), or 9 contacts (3 pairs) per column 2 mm pitch, 5-pair configuration provides 63 differential pairs per linear inch on 25 mm (1.0 inch) card slot spacing Wider 3 mm column spacing offers the opportunity to reduce board cost by routing more traces on a single board layer Compact 12 mm-wide power modules provide increased current-carrying capacity of 80 Amps with 150 V voltage rating "Eye of the Needle" (EON)-compliant tail for press-fit PCB termination Available guidance modules provide alignment capability prior to connector engagement Lead-free and RoHS-compatible options are available |