| FEATURES RoHS compliant (Lead-Free) options are available Optimized design for utilization in high-density, high-speed mezzanine applications Ball Grid Array (BGA) termination for process friendly attachment 1mm x 0.65mm BGA interface pitch optimizes routing and electrical performance Stack Heights available from 15mm to 40mm provide mezzanine design flexibility Connector sizes of 200 and 296 signals providing 62 signal contacts per linear cm (158 signal contacts per linear inch) allow for optimization of board space and signal requirements 100 Ohm differential pair matched impedance assures consistent high speed performance Up to 10 Gb/s differential pair performance |