Ident System CIS - EUCHNER GmbH + Co. KG - #39

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39 Ident System CIS3A-Mini Subject to technical modifications; no responsibility is accepted for the accuracy of this information. 9,98 0 -0,05 0815EEEE 4 0 +0,2 Data carrier CIS3AP10D05KH01K... Dimension drawing Data carrier CIS3AP10D05KH01K... Active face Cylindrical design 10 mm Unprogrammed or programmed ƒô ƒô Ordering table Series Design Version Order no. / item Data carrier for CIS3A-Mini Cylindrical 10 mm Unprogrammed 077 785 CIS3AP10D05KH01K Programmed 092 320 CIS3AP10D05KH01K-P For possible combinations see page 33 Programming The data carrier can be written (programmed) for read-only operation with a maximum of 8 hexadecimal digits (value from 0hex to Fhex) on customer request. Standard filler digit after the customer-specific defined digits is Ehex. The housing is permanently laser marked with the digits programmed (not including filler digits) in hexadecimal notation. Technical data Parameter Value Unit min. typ. max. Memory capacity (read/write) - 116 - bytes Housing material Plastic PPS Weight 0.001 kg Degree of protection according to EN 60529 IP67 Ambient temperature -25 - +70 °C Type of installation Bonded, flush (also in metal) Memory organization Write Read Only possible in 4-byte blocks Possible byte by byte Operating parameters on reading using read/write head CIT3ASX1N12ST and interface adapter CIA3PL1G08 or CIA3SX1R1G08 Read distance sL for non-metallic environment 0 3 6.5 mm Read distance sL on flush installation in iron 0 3 6 Read distance sL on flush installation in aluminum 0 3 5 Center offset mL (for sL = 3 mm) - - ± 2.5 Number of read cycles Not limited Operating parameters on writing using read/write head CIT3ASX1N12ST and interface adapter CIA3SX1R1G08 Write distance sS for non-metallic environment 0 3 6 mm Write distance sS on flush installation in iron 0 3 5.5 Write distance sS on flush installation in aluminum 0 3 4.5 Center offset mS (for sS = 3 mm) - - ± 2 Number of write cycles 100,000 - - cycles Mounting instructions For fastening use e.g. two-component epoxy resin adhesive.