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PCB Connectors DIN high density 4-row
modules DIN high density 5-rowmodules DIN creepage-proof modules D and E DIN creepage-proof
modules F, Fi IEC 60603-2Pressfit technology, solder,wire wrap technology.128
2.54 mm IEC 60603-2Pressfit technology, solder,wire wrap technology80, 160
2.54 mm IEC 60603-2Pressfit technology, solder,hand solder16, 32, 48
5.08 mm IEC 60603-2Pressfit technology, solder,hand solder32, 48
5.08 mm Din connectors are also avail-able in high density, such as
the CD 128 or RD 128. Type CD 128 is available in a standard male connectorwith right angle contacts or a
vertical female connector. Type RD 128 is inverted. The four possible contact rows can be assembled with a maximum of 32 contacts inthe 2.54 mm grid.
Modules: CD 128, RD 128 E 160 connectors are design-ed for use where more and
more connections are required
for a circuit board. A total of362 contacts are available on asandwich-type Eurocard, with
two E 160 connectors and oneERNI intermediate connector.The TE 160 module is the inverted version and also hasfive contact rows. The highdensity type E 160 connector
is also available in an E 80 half
module. E 80 connectors arefive rows, with 16 contacts perrow.
Modules: E 160, E 80, TE 160 Type D and E connectors weredeveloped for high-current load
applications. Type D, 32 con-
tacts, can handle up to a 5.5 Aload at an ambient temperatureof 20°C. Type E is available up
to 48 contacts with a currentload of 5.5 A at 20°C. With a clearance and creepage
distance of 3.0 mm, these con-nectors are very resilient. Modules D, E Type F connectors have highclearance and creepage dis-
tances between contact and
ground. This connector has asmaller grid (3.81 mm) whichallows for a design width of 3U
(3 x 5.08 mm) in the subrack.The Fi module is a special ver-sion for EX-protected zones.
Modules: F, Fi 18Catalog E 074519Edition 4, 10/07 www.erni.com
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