ERmet ZDHigh Speed Differential Hard Metric Connector System Additional Mechanical Features

Termination Details

Front CoverWafer AssemblyRear Organizer Optional Allignment Module ERmetZD backplane and daughter card modules are avail-able in pressfit versions. The parts are fully intermateable and differ physically only in their printed circuit board layout requirements.The pressfit versions utilize the same eye of the needle compliant pin design for both the signal and ground terminals. The finished plated through-hole requirements are0.55mm to 0.65mm which is the same hole specified by IEC 61076-4-101 for all 2mm HM connectors. All ERmetZD modules are designed with an air gap between the connector and the board to facilitate convection reflow soldering methods. Additionally, the housing materials are comprised of a thermally stable polymer made to withstand higher temperatures.

Alignment Modules

The solid alignment modules secure correct mating of large size daughter cards. To prevent damage to a system resulting from incorrect insertion of cards with different logic, coding keys can be snapped into the optional alignment modules. These are the same color coded keys defined within the IEC61076-4-101 standard. The IEC standard defines a uniqueconfiguration and color for more than 70 different coding keys.
306Catalog E 07448410/07Edition 8www.erni.com