MicroSpeed

Power Modules

General Technical Features
This complementary range of Power Module connectors, with2.0 mm contact pitch, fulfils the need for miniaturized and highreliability power systems, and offers a large number of options for mezzanine applications. One of its unique features is its high current-carrying capacity in comparison to its small size. Therefore, the system is ideally suited for use with small, highperformance devices such as CPUs, drives, LCD panels,etc.Providing a variety of height versions of the male and female connectors, the Power Module series enables stacking heights from 5 mm to 20 mm. Subsequently, almost every need for different PCB arrangements can be addressed. Another majoradvantage is the multiple-connector mating capability, whichallows the mating of more than one connector pair at the same time. The SMT connectors meet all the needs of fast automatic assembly machines. They are manufactured and 100% inlinequality checked by machine to ensure high coplanarity and opti-mized soldering. The layout is designed with an optimal solder pad size to guarantee high retention forces. The integrated 3-point double beam female contact ensures durable low-contact resistance over the whole lifecycle. The contacts arepost plated, leaving no bare edges in the contact and solder areas. The connectors are equipped with polarized positioning pegs, and the connector plating is lead free, complying with the European RoHS directive. The MicroSpeed Power Modules arespecified for a temperature range of -55°C to +125°C. •Current carrying capacity: 6-8 A •Termination: Power contact SMTShield metall sheet SMT or THR•Partiall contact loading is possible •Board-to-board heights 5-20 mm •Materials:Insulation body: LCP Contact: Cu alloy•Plating:Mating area: Gold platedTermination area: Sn•Tape and reel packaging Catalog E 07448410/07Edition 8www.erni.com21