MicroSpeed

Signal Connectors

General Technical Data

The high-speed SMT connector MicroSpeed with the pitch1.0 mm is especially designed for modern board-to-board applications in telecom and datacom equipments. For next generation systems with data rates up to 10 GBit/s is this new modular connector system the right solution. MicroSpeed features differential signal transmission with aimpedance of 100 â„¦ or single ended signal transmission witha impedance of 50 â„¦ . Two different signal contact arrange-ments are possible. An excellent signal integrity is achievedby a design with 2 signal and 2 shield contact rows. The termination area of the shield contacts is available in 2 options: SMT or THR (Thru Hole Reflow). For fully automatic SMT assembly the connector is provided with tape-and-reel packaging.
Electrical data Differential impedance: 100 OhmSingle ended impedance: 50 Ohm Crosstalk: < 2% at 100 ps Reflection factor: < 5% (for board thickness of 1.6 mm)Current rating: min. 1 A at 20°
Material data Insulator: LCP Contact Material: Cu alloy Plating:Mating area: Gold plated Termination area: Sn

Features

Pitch:within row: 1.0 mm within column: 1.5 mmStyle: Vertical male and vertical female connectors Number of pins: signal contacts: 50 ground contacts: 18Module length: app. 27 mmTermination style:signal contacts: SMT ground contacts: THR or SMT
Catalog E 07448410/07Edition 8www.erni.com17