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Important Factors in the Lapping Process

In order for superfi nishing processes to yield precise, repeatable results, a complex set of factors must be brought into balance and matched to the application at hand.Hyprez fl at lapping and polishing machining systems are engineered to give you maximum control over these crucial factors:
â–  Precision dispensing and metering of slurries
â–  Pressure on the workpiece
â–  Speed of the plate (tool)
â–  Plate material and characteristics
â–  Plate surface confi guration (grooves)
â–  Ambient conditions of the processing room
â–  Engis manufactures a complete line of standard-sized conditioning rings and part holders, as well as specialized controls, custom slurries, fi xturing and other application-specifi c accessories. Type and size of abrasive particles
â–  Type of carrier (vehicle) used, if applicable
â–  Optimum operating temperatures
â–  Plate fl atness requirements, methods of measurement

Diamond Lapping Benefi ts

â–  Requirements for lubricants, plus lubricant attributes
Machining Problems Lapping - Benefi ts â–  Consideration of plate ramp-up/ramp-down speeds Clamping distortion Stress-free Multiple machining steps Single step to fi nish Brittle parts Low p.s.i. – low losses Composite/dissimilar materials Same stock removal Non-metallic/magnetic materials Easily accommodated Thermal distortion Eliminated – water cooled Thin part capability – poor Less than 0.005”
â–  Consideration of ramping pressures for the workpiece
â–  Method of charging and conditioning the plate
â–  Conditioning/retaining ring in-process use
â–  Diamond delivery system and positioning
â–  In-process swarf removal
Electronic precision dispensing systems, conditioning rings, part holders and other accessories are designed by Engis to integrate your lapping system with maximum effi ciency. Hyprez diamond powders, slurries, compounds and lubri-cants make up the broadest in the industry, with micron sizes and formulations for virtually every application. 3