The Hyprez
®
Total System
At Engis, we build the machines, confi gure the components and formulate our compounds and slurries with one goal in mind: to deliver a total system of Hyprez products with the capabilities you need in your fl at lapping and polishing operations – capabilities that include:
â– System Compatibility
â– Operational Flexibility
â– Consistent, Repeatable Performance
System Compatibility with Engis Equipment Operational Flexibility with Hyprez Consumables Process Flexibility and Technical Support
Hyprez fl at lapping and polishing machines bring high performance and economic effi ciencies to your operation. Capable of consistently and repeatedly generating surface fi nishes to 0.5 nm Ra and surface fl atness to 1/20 wavelength, Hyprez systems are suitable for processing virtually all solid materials, including metals, ceramics, glass, semiconductor substrates and electro-optical materials.Engis offers the most comprehensive choice of machine models designed specifi cally for advanced materials. There is a Hyprez diamond product for virtually every application. Engis invests in its customers by making available a wealth of diamond expertise and technical support through our process development labs.
â– Our
powders, slurries, compounds and pastes come in a wide variety of micron sizes and carriers.
â– The Hyprez Process Development Lab enables customers to experiment with various options and combinations of machines, plates, compounds, lubricants and processing parameters. The result is a deep understanding of the capabilities of your Hyprez system and an on-going relationship with Engis’engineers and support personnel.
â– Engis offers the largest selection of lapping plates in the industry. Hyprez composite lapping plates are designed to maximize the cutting characteristics of Hyprez diamond slurries and compounds.
â– Parts carriers, conditioning rings, dispensing accessories and other consumables are all designed to optimize system compatibility – enabling more effi cient and effective performance, consistently and repeatedly.
â– The Wafer Processing Lab is focused on producing specialized slurries, processes and machining parameters that boost yields and throughput in the superfi nishing of wafer substrates for the semiconductor and compound semiconductor industries.
Totally Integrated Diamond Flat Lapping & Polishing Systems – Only from Engis
Hyprez
lapping machines are available in single and double sided models, ranging from15” tabletop models to 42”fl oor production models. Both special composite and natural metal lapping plates are engineered to maximize the cutting character-istics and performance of diamond superabrasives. 2
