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| | | Subminiature Switch SB5 | | |
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| | | EBE | | |
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| | | | | | | | | | 1.0 Construction | | | | 1.1 Number of banks max. | 1 bank | | | | 1.2 Switching combinations per bank Design J, detent angle 90° | 1x2; 2x2 with contactless central position at 45° | | | | Design G, detent angle 45° | 1x3 | | | | 1.3 Contacts for SMT | J-hook=version A; Gullwing = version B | | | | Contacts for printed circuits | Soldering pins = version C | | | | 1.4 Mounting | Soldering | | | | 2.0 Electrical Data | | | | 2.1 Switching power max. | 0,5W | | | | 2.2 Switching voltage max. | 16V- | | | | 2.3 Switching current max. | 100 mA | | | | 2.4 Test voltage at 50 Hz | 500 V | | | | 2.5 Operating life without power | > 200 cycles | | | | 2.6 Contact resistance initial value | < 100 mfl | | | | 2.7 Insulation resistance | 1x108 Q | | | | 3.0 Mechanical Data | | | | 3.1 Switching mode | Nonshorting | | | | 3.2 Stops | Fixed | | | | 3.3 Operating torque | 2,5 Ncm | | | | 3.4 Shock strength | 50g | | | | 3.5 Dust protection | Bank sealed | | | | 3.6 Cleaning* | Suitable for complete cleaning in ultrasonic bath | | | | *With known agents, such as Freon, Arclone usw. | | | | | 4.0 Other Data | | | | 4.1 Contact material | Ag | | | | 4.2 Insulating material | Diallylphthalate, DAP; Code DI | | | | 4.3 Ambient temperature | -40 to +70C | | | | 4.4 Soldering time and temperature max. | 4s at 260°C,wave soldering 10s at 180C, Infrared-reflow-soldering Peak temperature 240C | | | | Ordering Codes | | | | | Designation of type SB5 | | | | 1. Number of circuits per bank 1 or 2 | | | | 2. Number of switching positions 2 or3 | | | | 3. Contacts A =J-hook, B =Gullwing, C = Soldering pins, standard | | | | | | | | | |
| | | Subminiature switch with extremely small dimensions. • Developed for SMT soldering processes: wave- and infrared-reflow-soldering. • Suitable for automatically insertion with most of the„Pickand Place"-auto-mation machines. • For sufficiently large number of units also available in embossed tapes on request. | | |
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