Diprotex general introducing brochure - DIPROTEX - #3

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Specification and Manufacturing Process
<Conventional Grinding Wheels>
A1 60 K 7 V 35 (7)
255X25X25.4
Type of Abrasives
Grit Size
Grade
Structure
Bond Type
Bond Symbol
Shape
Size
A : Regular Aluminium Oxide
Coarse 8
Soft
1 1
Dens
1
Variety of bond symbol
1
Streight
A1 : White Aluminium Oxide
10
1
1 1
1
2
V: Vitrified
designate characteristics
2
Ring
Outer Diameter
A2 : Pink Alundum Oxide
12
J
3
of the wheel.
5
Recessed One Side
x
A6 : Mixture of Aluminium Oxide
!
K
;
B: Resinoid
<EExample>
6
Streight Cup
Thickness
A5 : Semi-Friable Aluminium Oxide
L
V35: Good cutting ability
7
Recessed two side
x
CBT : Ceramic Grain
!
\
1
R: Rubber
V104: For ceramic grain
11
Flaring Cup
Hole Size
C6 : Regular Silicon Carbide
4000
18
BZ: For ball lapping
C5 : Green Silicon Carbide
' 5000
1
\
19
B80W: For needle grinding
Fine 6000
Hard
Z
Open
20
R30: Standard rubber bond
M IXING
^^^^
BAKING
FINISHING ^pp^
VITRIFIED GRINDING WHEEL
<Superabrasive Wheels>
CB 80 M 200 V N1 1A1 350X25X127 3.0x
Type of Abrasives
Grit Size
Grade
Concentration (Vol% )
Bo nd Type
Bond Symbol
Shape(FEPA)
Size
X-Layer
CB: CBN (Cubic Boron Nitride)
#40-32,000
Soft \
Low
0 (0.0%)
Variety of bond symbol
1A1: Streight
Outer
1
V: Vitrified
designate characteristics
Diameter
X-Layer means the
CBC: Metal Coated CBN
#40-12,000
L
N
50 (12.5%)
B: Resinoid
of the wheel.
1A1R: with Recess for cut-off wheel
x
Thickness
thickness of CBN/ Diamond layer
D: Natural Diamond
#16-325
P R
1 00 (25.0%)
M: Metal
<Example>
VN1 (Vitrified Bond)
x
Hole Size
<Example>
SD: Synthetic Diamond
#60-64,000
T
1 50 (37.5%)
P: Plated
BW6 (Resinoid Bond) MH4 (Metal Bond)
6A2: Disc
3x = 3.0 mm
SDC: Metal Coated
#60-700
High
200 (50.0%)
PA5 (Electro Plated)
1A10R: Insite Cutter
Synthetic Diamond
Hard
PRESS
S
FIRING
BAKING
HOT PRESS(SINTERING)
VITRIFIED
DIA/CBN
WHEEL
GRAIN
WEIGHING
M IXING
RESINOID DIA/CBN WHEEL
BOND
METAL BOND DIA/
CBN WHEEL
CORE

pageCatalog pdf di En 2012-02-07-17