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| | | Specification and Manufacturing Process | | |
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| | | <Conventional Grinding Wheels> A1 60 K 7 V 35 (7) | | |
| | | 255X25X25.4 | | |
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| | | | | | | | | | | | | | | | | | | | | | Type of Abrasives | Grit Size | Grade | Structure | Bond Type | Bond Symbol | Shape | Size | | | | A : Regular Aluminium Oxide | Coarse 8 | Soft | 1 1 | Dens | 1 | | Variety of bond symbol | 1 | Streight | | | | | A1 : White Aluminium Oxide | | 10 | 1 | | 1 1 | 1 | | 2 | V: Vitrified | designate characteristics | 2 | Ring | Outer Diameter | | | | A2 : Pink Alundum Oxide | | 12 | | | J | | | 3 | | of the wheel. | 5 | Recessed One Side | x | | | | A6 : Mixture of Aluminium Oxide | | ! | | | K | | | ; | B: Resinoid | <EExample> | 6 | Streight Cup | Thickness | | | | A5 : Semi-Friable Aluminium Oxide | | | | | L | | | | | V35: Good cutting ability | 7 | Recessed two side | x | | | | CBT : Ceramic Grain | | ! | | | \ | | | 1 | R: Rubber | V104: For ceramic grain | 11 | Flaring Cup | Hole Size | | | | C6 : Regular Silicon Carbide | | 4000 | | | | | | 18 | | BZ: For ball lapping | | | | | | | C5 : Green Silicon Carbide | | ' 5000 | 1 | | \ | | | 19 | | B80W: For needle grinding | | | | | | | | Fine 6000 | Hard | Z | Open | 20 | | R30: Standard rubber bond | | | | | | | | | | | | | | | | | | | | | | | | |
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| | | BAKING | | |
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| | | FINISHING ^pp^ | | |
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| | | VITRIFIED GRINDING WHEEL | | |
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| | | <Superabrasive Wheels> | | |
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| | | CB 80 M 200 V N1 1A1 350X25X127 3.0x | | |
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| | | | | | | | | | | | | | | | | | | | Type of Abrasives | Grit Size | Grade | Concentration (Vol% ) | Bo nd Type | Bond Symbol | Shape(FEPA) | Size | X-Layer | | | | CB: CBN (Cubic Boron Nitride) | #40-32,000 | Soft \ | Low | 0 (0.0%) | | Variety of bond symbol | 1A1: Streight | Outer | | | | | | | | 1 | | | | V: Vitrified | designate characteristics | | Diameter | X-Layer means the | | | | CBC: Metal Coated CBN | #40-12,000 | | L N | | | 50 (12.5%) | B: Resinoid | of the wheel. | | x Thickness | thickness of CBN/ Diamond layer | | | | D: Natural Diamond | #16-325 | | P R | | | 1 00 (25.0%) | M: Metal | <Example> VN1 (Vitrified Bond) | | x Hole Size | <Example> | | | | SD: Synthetic Diamond | #60-64,000 | | T | | | 1 50 (37.5%) | P: Plated | BW6 (Resinoid Bond) MH4 (Metal Bond) | 6A2: Disc | | 3x = 3.0 mm | | | | SDC: Metal Coated | #60-700 | | | High | 200 (50.0%) | | PA5 (Electro Plated) | 1A10R: Insite Cutter | | | | | | Synthetic Diamond | | Hard | | | | | | | | | | | | | | | | | | | | | | | | | | | |
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| | | | | | | | | | | PRESS | S | FIRING | | | | | BAKING | | | | HOT PRESS(SINTERING) | | | | | | | | | | |
| | | VITRIFIED DIA/CBN WHEEL | | |
| | | GRAIN | | |
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| | | WEIGHING M IXING | | |
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| | | RESINOID DIA/CBN WHEEL | | |
| | | BOND | | |
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| | | METAL BOND DIA/ CBN WHEEL | | |
| | | CORE | | |
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