Type CC Low Resistance Precision Chip Resistors - Caddock Electronics - #1

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Sales and Corporate Office 1717 Chicago Avenue Riverside, California 92507-2364 Phone: (951) 788-1700 Fax: (951) 369-1151 Applications Engineering 17271 North Umpqua Hwy. Roseburg, Oregon 97470-9422 Phone: (541) 496-0700 Fax: (541) 496-0408 e-mail: caddock@caddock.com • web: www.caddock.com For Caddock Distributors listed by country see caddock.com/contact/dist.html © 2004 Caddock Electronics, Inc. CADKDOC CC1512FC Standard Resistance Values: Tolerance CC1512FC ±1% Standard (except as noted). CC2015FC Standard Resistance Values: Tolerance CC2015FC ±1% Standard (except as noted). CC2520FC Standard Resistance Values: 0.010 Ù 5% 0.015 Ù 5% 0.020 Ù 5% 0.025 Ù 5% 0.030 Ù 5% Tolerance CC2520FC ±1% Standard (except as noted). 0.033 Ù 5% 0.040 Ù 5% 0.050 Ù 2% 0.075 Ù 2% 0.10 Ù 0.15 Ù 0.20 Ù 0.25 Ù 0.30 Ù 0.33 Ù 0.40 Ù 0.50 Ù 0.75 Ù 1.00 Ù 1.50 Ù 2.00 Ù 2.50 Ù 3.00 Ù 0.010 Ù 5% 0.015 Ù 5% 0.020 Ù 5% 0.025 Ù 5% 0.030 Ù 5% 0.033 Ù 5% 0.040 Ù 5% 0.050 Ù 2% 0.075 Ù 2% 0.10 Ù 0.15 Ù 0.20 Ù 0.25 Ù 0.30 Ù 0.33 Ù 0.40 Ù 0.50 Ù 0.75 Ù 1.00 Ù 1.50 Ù 2.00 Ù 2.50 Ù 3.00 Ù 0.020 Ù 5% 0.025 Ù 5% 0.030 Ù 5% 0.033 Ù 5% 0.040 Ù 5% 0.050 Ù 2% 0.075 Ù 2% 0.10 Ù 0.15 Ù 0.20 Ù 0.25 Ù 0.30 Ù 0.33 Ù 0.40 Ù 0.50 Ù 0.75 Ù 1.00 Ù 1.50 Ù 2.00 Ù 2.50 Ù 3.00 Ù 3.30 Ù 4.00 Ù 5.00 Ù 7.50 Ù 8.00 Ù 10.0 Ù Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering. Recommended Circuit Board Layout (current and sense connections): Fig. 1A: Kelvin layout recommended for values below 0.20Ù Fig. 1B: Kelvin layout recommended for higher resistance values. Type CC Low Resistance Precision Chip Resistors Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering. Note 1: General Applications - The power rating for general applications is based upon 0.5 sq. in. (300 mm2) of termination pad or trace area (2 oz. copper) connected to each end of the resistor. Maximum chip temperature is 150°C. Use Derating Curve to derate appropriately for the maximum ambient temperature and for the temperature limitations of the adjacent materials. Note 2: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the center of the termination pad (point X in the recommended circuit layouts shown below). Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application. Style FC Derating Curve For General Applications 3.30 Ù 4.00 Ù 5.00 Ù 7.50 Ù 8.00 Ù 10.0 Ù 3.30 Ù 4.00 Ù 5.00 Ù 7.50 Ù 8.00 Ù 10.0 Ù S SXXCCCXXSSCC C = Current connection S = Sense connection Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown. 0.015 Ù0.010 ÙModelResistanceMin.Max.Power Capability InformationCC1512FCCC2015FCCC2520FC10.0 Ù0.020 Ù10.0 Ù0.020 Ù10.0 Ù0.020 Ù0.010 Ù0.025 Ù150°C0.75 WattMax. ChipTemperatureGeneral ApplicationsHigh Power ApplicationsThermal Resistance - RèJCFilm (J) to Solder Pad (C)(see note 2)22.7°C/WattPower Ratingat 70° C(see note 1)22.7°C/Watt16.0°C/Watt13.0°C/Watt11.5°C/Watt150°C150°C150°C150°CDimensions in inches and (millimeters).150 ±.007(3.81 ±.18)ABD.120 ±.007(3.05 ±.18).035 min.(0.89 min.)C.027 ±.005(.69 ±.13).250 ±.007(6.35 ±.18).200 ±.007(5.08 ±.18).065 min.(1.66 min.).032 ±.005(.81 ±.13).250 ±.007(6.35 ±.18).200 ±.007(5.08 ±.18).040 min.(1.02 min.).041 ±.004(1.04 ±.10).200 ±.007(5.08 ±.18).150 ±.007(3.81 ±.18).050 min.(1.27 min.).027 ±.003(.69 ±.08).150 ±.007(3.81 ±.18).120 ±.007(3.05 ±.18).035 min.(0.89 min.).022 ±.003(.56 ±.08)CommentsSolder Coated PadsSolderable PadsSolderable PadsSolder Coated PadsSolderable Pads0.75 Watt1.0 Watt1.5 Watts1.5 WattsAMBIENT TEMPERATURE, CRATED LOAD, % o1008060402002510015070 • Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pads to receive aluminum wire bonds. • Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina. • Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%, and 0.10 ohm at ±1%. • Low inductance provides excellent high frequency and pulse response. • High pulse handling and overload capability. • Best choice for switching power supplies, motor speed controls, and high current sensing applications. Page 1 of 2 28_IL106.1004