General catalogue - Caddock Electronics - #8

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Style WB - Wire Bond Version is a hybrid mountable version with copper pedestal terminals and an aluminum surface layer for wire bonding. The back surface of these devices is metallized for solder attachment of the chip resistor to a heat sinking substrate.

Tolerance CD2015WBA ±1% Standard.

Note 3: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the soldered interface with the circuit board. Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application.

0.010 a 0.015 a 0.020 a

0.025 a

0.030 a 0.033 a 0.040 a

0.050 a

0.075 a

0.10 a 0.20 a

Tolerance CD2520WBA ±1% Standard.

0.010 a 0.030 a 0.075 a

Note: The sense connection for each pedestal is positioned inboard of the current connection (single or multiple current wires).

Film Temperature Measuring Point

0.015 a 0.020 a 0.025 a

0.033 a 0.040 a 0.050 a

0.10 a 0.20 a

Sense Wire

Sense Wire

Current Wire

Current Wire

Solder pad, soldered interface with circuit board.

Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering.

Temperature Coefficient: TC referenced to +25°C, AR taken at +150°C.

0.050 ohm to 0.20 ohm, 0 to +100 ppm/°C. 0.010 ohm to 0.049 ohm, 0 to +200 ppm/°C.

Inductance: Less than 5 nH typical.

Load Life: 1000 hours at rated power, based upon 150°C max. chip temperature, AR ± (0.5% + 0.0005 ohm).

Momentary Overload: 1.5 times rated power, for 5 seconds, AR ± (0.5% + 0.0005 ohm).

Operating Temperature: -55°C to +150°C.

Measurement Note: All measurements are taken using Kelvin connections per the recommended connection locations.

During soldering of the Type CD Resistor the soldering temperature profile must not cause the pedestal terminals of this device to exceed 220°C.

Style FC - Flip Chip version resistors have a bare ceramic back surface. The recommended solder for flip chip solder attachment is 62Sn / 36Pb / 2Ag. Style WB - Wire Bond version resistors have a metallized back surface for soldering to a substrate or a heat sink. The recommended solder is

62Sn / 36Pb / 2Ag.

Style FC, flip chip resistors, are shipped with the bare ceramic side up in the pocket, with the solderable pedestals facing down.

Style WB, wire bondable resistors, are shipped with the wire bondable pedestals facing up in the pocket. The illustration shows the orientation of the CD2015 chip resistors in the tape. The CD2520 chip resistors are rotated 90° from what is shown in the illustration.

7" dia. _ (178 mm)

o o o o o

12mm

0.473"

h^A°i

Ko signifies tape thickness and dimension

.512" arbor hole

(13mm)

2015 = 0.200" x 0.150" 2520 = 0.250" x 0.200"

Full reel quantities:

1000 pieces per reel for CD2015 and CD2520 Quantities of less than 250 will be shipped in tape without reel and without tape leader at the option of Caddock. Tape dimensions and materials will be consistent with EIA-481-1. Reels will be marked with a label containing Caddock logo, part number, resistor value, tolerance, packaging date, and quantity.

±1% 0.010 n and above.

FC or WBA

See charts for availability

17271 North Umpqua Hwy. Roseburg, Oregon 97470-9422 Phone: (541) 496-0700 Fax: (541) 496-0408

1717 Chicago Avenue Riverside, California 92507-2364

Phone: (951) 788-1700

Fax: (951) 369-1151

e-mail: caddock@caddock.com • web: www.caddock.com For Caddock Distributors listed by country see caddock.com/contact/dist.html

© 2004 Caddock Electronics, Inc.

28_IL107.1004