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Resistor array, Thick-film resistor, Chip resistor, Resistor, High-voltage resistor

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Type CC Low Resistance Precision Chip Resistors
Page 1 of 2
Style FC - Flip Chip version for surface mount applications. Style WB - Wire Bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pads to receive aluminum wire bonds.
Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina. Resistance range down to 0.010 ohm at ±5%, 0.050 ohm at ±2%, and 0.10 ohm at ±1%.
Low inductance provides excellent high frequency and pulse response. High pulse handling and overload capability.
Best choice for switching power supplies, motor speed controls, and high current sensing applications.
Style FC - Flip Chip Version is a surface mount version with solderable pads for flip chip soldering.
Power Capability Information
Model
Resistance
General Applications
Power Rating
at 70° C (see note 1)
High Power Applications
Thermal Resistance - Rejc Film (J) to Solder Pad (C) (see note 2)
Max. Chip Temperature
Dimensions in inches and (millimeters)
Comments
Min.
Max.
A
B
C
D
CC1512FC
0.010 Q
0.015 a
0.75 Watt
22.7°C/Watt
150°C
.150 ±.007 (3.81 ±.18)
.120 ±.007 (3.05 ±.18)
.027 ±.005 (.69 ±.13)
.035 min. (0.89 min.)
Solder Coated Pads
0.020 Q
10.0 a
0.75 Watt
22.7°C/Watt
150°C
.150 ±.007 (3.81 ±.18)
.120 ±.007 (3.05 ±.18)
.022 ±.003 (.56 ±.08)
.035 min. (0.89 min.)
Solderable Pads
CC2015FC
0.020 Q
10.0 a
1.0 Watt
16.0°C/Watt
150°C
.200 ±.007 (5.08 ±.18)
.150 ±.007 (3.81 ±.18)
.027 ±.003 (.69 ±.08)
.050 min. (1.27 min.)
Solderable Pads
CC2520FC
0.010 Q
0.020 a
1.5 Watts
13.0°C/Watt
150°C
.250 ±.007 (6.35 ±.18)
.200 ±.007 (5.08 ±.18)
.032 ±.005 (.81 ±.13)
.065 min. (1.66 min.)
Solder Coated Pads
0.025 Q
10.0 a
1.5 Watts
11.5°C/Watt
150°C
.250 ±.007 (6.35 ±.18)
.200 ±.007 (5.08 ±.18)
.041 ±.004 (1.04 ±.10)
.040 min. (1.02 min.)
Solderable Pads
CC1512FC Standard Resistance Values:
Tolerance CC1512FC ±1% Standard (except as noted).
Style FC Derating Curve For General Applications
0.010 a
5%
0.033 a
5%
0.20 a
0.75 a
3.30 a
0.015 a
5%
0.040 a
5%
0.25 a
1.00 a
4.00 a
0.020 a
5%
0.050 a
2%
0.30 a
1.50 a
5.00 a
0.025 a
5%
0.075 a
2%
0.33 a
2.00 a
7.50 a
0.030 a
5%
0.10 a
0.40 a
2.50 a
8.00 a
0.15 a
0.50 a
3.00 a
10.0 a
Note 1: General Applications - The power rating for general applications is based upon 0.5 sq. in. (300 mm2) of termination pad or trace area (2 oz. copper) connected to each end of the resistor. Maximum chip temperature is 150°C. Use Derating Curve to derate appropriately for the maximum ambient temperature and for the temperature limitations of the adjacent materials.
100
80
< O
60
40
LJ LU
te
CC2015FC Standard Resistance Values:
Tolerance CC2015FC ±1% Standard (except as noted).
20
0.020 a
5%
0.033 a
5%
0.20 a
0.75 a
3.30 a
0.025 a
5%
0.040 a
5%
0.25 a
1.00 a
4.00 a
0.030 a
5%
0.050 a
2%
0.30 a
1.50 a
5.00 a
0.075 a
2%
0.33 a
2.00 a
7.50 a
0.10 a
0.40 a
2.50 a
8.00 a
0.15 a
0.50 a
3.00 a
10.0 a
0
25 70 100 150
AMBIENT TEMPERATURE, 0 C
Note 2: Thermal Resistance - In High Power Applications where the circuit board material provides high heat sinking benefits (such as IMS, Alumina, or other) the thermal resistance of the chip resistor is useful to establish the maximum power capability of the chip resistor in the application. The film temperature is measured at the center of the resistor element and the solder pad temperature is measured at the center of the termination pad (point X in the recommended circuit layouts shown below). Maximum temperature of the chip resistor (at the center of chip) should not exceed 150°C through the temperature range of the application.
Recommended Circuit Board Layout (current and sense connections):
CC2520FC Standard Resistance Values:
Tolerance CC2520FC ±1% Standard (except as noted).
0.010 a
5%
0.033 a
5%
0.20 a
0.75 a
3.30 a
0.015 a
5%
0.040 a
5%
0.25 a
1.00 a
4.00 a
0.020 a
5%
0.050 a
2%
0.30 a
1.50 a
5.00 a
0.025 a
5%
0.075 a
2%
0.33 a
2.00 a
7.50 a
0.030 a
5%
0.10 a
0.40 a
2.50 a
8.00 a
0.15 a
0.50 a
3.00 a
10.0 a
Custom resistance values and non-standard tolerances can be manufactured for high quantity applications. Please contact Caddock Applications Engineering.
Fig. 1A: Kelvin layout recom­mended for values below 0.20Q
C = Current connection S = Sense connection
CC
Fig. 1B: Kelvin layout recommended for higher resistance values.
XX
XX
SS
S S
Note: Actual width of current trace is based on magnitude of current. Point of connection should be in the area shown.
ÎADDOC
Applications Engineering
17271 North Umpqua Hwy. Roseburg, Oregon 97470-9422 Phone: (541) 496-0700 Fax: (541) 496-0408
Sales and Corporate Office
1717 Chicago Avenue Riverside, California 92507-2364 Phone: (951) 788-1700 Fax: (951) 369-1151
e-mail: caddock@caddock.com • web: www.caddock.com For Caddock Distributors listed by country see caddock.com/contact/dist.html
© 2004 Caddock Electronics, Inc.
28_IL106.1004
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