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Description Delete/complete Comments/Details Notes where applicable Qty of boards Disassembly required Y/N (please provide details)Board dimensions* Length:LxWxH in mm. Max for Width: silicon dip only is 350 x 350mm Height:Coating material (acrylic will Acrylic/be used without preference Plyurethane/ stated) SiliconePre-clean required?** Y/N D.I. Water Safewah AbzolMasking details to be supplied Engineering- Drawing/ PhotographConformal coating removal only*** Localised area/ complete board

Materials: Humiseal 1B31, 1A33 and 1H20. Electrolube HPA, DCA(SCC3). Others upon request. IPC-CC-830B Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies IPC-A-610 Acceptability of Electronic Assemblies IPC/EIA J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies Standards: * Maximum practical board dimensions for spraying: 600mm x 500mm**Deionised water only to be specified where water soluble flux has been used ***Component rework services available by separate agreement

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