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Amplifier module, Converter, Filter, Power supply, Fiber-optic amplifier
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OUR EXPERTISE COVERS: IPC 610C certified production operatives Product qualification via independently accredited Test House Low to medium volume production Precision solder cream printing Fully automated optical inspection (AOI) Chip on Board (COB) - mixed technolo-gies Flip-chip attach and under-fill Epoxy dam and fill or silicone encapsulation Real time X-ray inspection Selective wave soldering for through-hole components
PCB layout designed with Pantheon software Conformal coating for humidity & dust protection OUR PCB ASSEMBLY PROCESSES INCORPORATE: Full flying probe and bed-of-nails testing Precision placement to 12 micron accuracy Board sizes up to 460mm x 410mm FR4 or duroid based Robotic soldering system with auto-feed solder wire Component placement to 0201 body size Four SMT lines Placement rates 5,000 - 12,000 per hour design dependent Auto and semi-auto BGA attach with full rework capability Surface mount technology using RoHS compliant and SnPb solders No-clean and aqueous fluxes For further information contact us at: C-MAC MicroTechnology South Denes, Great Yarmouth, Tel: +44 (0) 1493 743 100Norfolk, NR30 3PX, UK Email: info@cmac.comJanuary 2008 |
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