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Substrates and tapes: Range of LTCC tape materials from DuPont and Ferro. Conductors: Silver, gold, platinum, palladium silver and platinum silver Track width: Standard = 200 - 250um High Density = 100 - 150 umSeparation: Standard = 200 - 250um High Density = 100 - 125 um Resistors, capacitors, inductors Infinite range of values with sheet resistivities from 10 Ohms - 100k Ohms on the sur- face or embedded in the structure. Resistors: Surface tolerance: +/-1% Embedded tolerance: +/-15% of typeCapacitors: X7R dielectric: up to 3000pF +/-20% NPO dielectric: up to 200pF +/-10% Inductors/transformers Cavities Wide range available based on standard tape or ferrite tape material systems and con- figured as spirals or helical coils. Components may be mounted in cavities so that the active surface is co-planar with the substrate surface and therefore minimise module height, and enable short and control- led impendence wirebonds. Vias Vias can be stacked, staggered, buried or blind. Hermeticity is achieved with a dielectric barrier Dielectric vias: Standard = 150 - 250um High density = 100 - 150um Via pitch: Standard = 3x - 4x via size High density = 2.5x via size
For further information contact us at: C-MAC MicroTechnology South Denes, Great Yarmouth, Tel: +44 (0) 1493 743 100Norfolk, NR30 3PX, UK Email: info@cmac.comJanuary 2008