Text version of the page

THE SOLUTION IN DETAIL

Interconnect Printed thick film on ceramic to 150 x 125mmPhoto defined thick film on ceramic to 150 x 125mm LTCC structures with cavities and integrated passives Organic (FR-4, GETEK
¨ , ROGERS
¨ ) Components Bare die - Si, GaAs, SiGE, InPh - Epoxy, Eutetic, Soldier, Flip-ChipPassive devices to 0201 SMD active devices in xSOP through large area BGA Component Placement High speed pick and place to 40,000 per hourThrough hole Surface mount (to 0201) Wire Bonding Gold or AluminiumWedge or Ball 17 microns to 500 microns diameter wire and ribbon Electrical/Environmental Test In-circuit ATEFull functional ATE Active YAG laser trim (DC to parametric adjust or tune) Temperature & environmental testing &qualification Quality &Certifications ISO-9001, QS-9000Telecordia
¨ , UL
¨ , CSA
¨ Services Statistical process control Continuous improvement &cost reduction programmes Employee training programmes Design, qualification, failure analysis Programme Management Programme manager &teamCustomer service oriented concurrent engineering Business Operations High volume/low mix, low volume/high mix environmentsCapacity planning - volume driven, mix driven, technology driven

Web site www.cmac.com

Optoelectronics Engineering GroupC-MAC North America Sales OfficeC-MAC MicroTechnology MicroTechnology 4518 S. Miami Blvd., Ste 180 South Denes, Great YarmouthNorfolk, NR30 3PX, UKTel: +44 (0) 1493 743100 Fax: +44 (0) 1493 858536Email: Durham, North Carolina 27703, USATel: +1 919 941-9333 Fax: +1 919 941 9371 mssinfo@cmac.com Email: cmac.microtechnology@ cmac .com C-MAC MicroTechnology Fibre Optical Module Solutions