Chip on Board (COB)

C-MAC MicroTechnology’s COB design and manufacturing method allows additional functionality to be introduced within the footprint constraints of existing components, eliminating the need to redesign the product package.We can upgrade or fix your product faster than using an ASIC and more quickly and cheaply than redesigning from scratch. We can save you time and extend the life of your product. The benefits of COB: ›› High packing density ›› Quick turnaround ›› Applicable to most substrates ›› Can mix standard assembly technologies ›› Enhanced thermal characteristics ›› Adapted to high frequencies (higher than IC in an SMD package)
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