P8060 Copper Bump - C&D Semiconductor Services Inc - #1

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Smart Solutions for the Semiconductor Industry C&D Semiconductor Services, Inc. • 2210 Lundy Avenue, San Jose, CA 95131 www.cdsemi.com Tel 408.383.1888 • Fax 408.383.1889 Maximum Flexibility - Saving Time and Money The P8060 Copper Bump Developer was designed specifically for developing dry laminated film resist. The high capacity heat exchanger allows process solution temperature to remain constant ± 2.0¢ªC and achieving up to 40¢ªC for long constant spray develop cycles often required by thick laminated films. The heat exchanger can control the developer temperature to four process modules simultaneously for maximum flexibility and throughput. C&D’s pressure tanks can interface with a bulk delivery system that dilutes the developer from a concentrate. This dilution system mixes and fills the canisters without track interruption saving time and money. The high performance spindle motor along with customer specific spray nozzles, stepping motor controlled raster arm, and constant flow and temperature control of developer all optimize CD control. The raster arm movement capability is a proven method for the copper bump process. The digital high performance stepper motor is key to achieving center to edge uniformity. •• Process 50 mm to 200 mm substrates •• High capacity heat exchanger •• High performance motors for improved uniformity and reliability •• PC based Windows Operating System •• C&D proven software platform •• Maintenance friendly - Component Exercise Mode •• Intuitive Programming with virtually unlimited recipe capability •• Upgraded ATS arms for improved repeatability •• CE Mark •• SECS/GEM Optional SYSTEM FEATURES The P8060 Copper Bump Developer is capable of high capacity manufacturing. With four process modules able to run simultaneously, the system throughput is maximized. C&D offers a variety of spray nozzles to choose from for customer specific spray fan patterns often required for dry films. The developer flow rate and pressure are fully adjustable. C&D’s proven software platform is a perfect fit for the Copper Bump process. The component exercise mode allows the user to optimize and to test spray patterns, supply pressure, and developer flow. P8060 Copper Bump Developer High Capacity Manufacturing