P8030 Frame System - C&D Semiconductor Services Inc - #1

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Smart Solutions for the Semiconductor Industry C&D Semiconductor Services, Inc. • 2210 Lundy Avenue, San Jose, CA 95131 www.cdsemi.com Tel 408.383.1888 • Fax 408.383.1889 Friendly flexible software- Sophisticated Robot C&D’s P8030 is designed to be an effective way of coating wafers prior to saw or cleaning wafers post saw. With its high performance spindle motor and high accuracy stepper motor driving the dispense arm, the P8030 is proven reliable and repeatable. After final rinse, the system can be configured with a nitrogen blow off capability. The SmartPro P8030 Frame Processing System can coat resists or polymers on thin wafers to assist with standard sawing or laser sawing. It can also be used to remove resist or protect coat polymers after saw. The system can handle an assortment of saw frame sizes and their complimentary cassettes. The P8030 Frame Processing System is proven to handle thin wafers on large frame tapes – with a solid history of handling saws with a 100um thick Gallium Arsenide wafers. The P8030 Frame Processing system can be configured either as a manual system or an auto loading system with a central atmospheric robot. Either the automatic system or the manual system is configurable for many common frame sizes. The automated system can be configured for most common cassette •• 50mm to 200mm substrate •• Coats can be photoresist, PVA, or any spin on coating •• Quick change chuck from different wafer/frame sizes •• Proven track control systems and pump controls •• Ability to coat very thin wafers mounted on frame and tape in preparation for laser scribing and/or sawing •• Capabililties to clean wafers on tape , to remove PVA and photoresist on frames after sawing or laser scribing have been proven to be effective and gentle. •• Cassette to cassette operation alongside a sophisticated robot. •• Cassette mapping SYSTEM FEATURES C&D’s unique counter balance chuck allows for various types of frames, wafer sizes, and overall weight of the frame and substrate. The chuck can be fabricated out of several types of material to best suit the customer’s process. The chuck design supports sawn substrates and prevents small die from being pulled down by vacuum. The P8030 Frame Processing System offers customers a system designed with a user friendly and flexible software package. C&D’s P8030 holds a proven track record of gently cleaning wafers post saw or laser scribing, including its capability of handling solvent or caustic cleans. P8030 Frame Processing System Various Wafers and Frame Sizes