Catalogue - Thermal Interface Selection Guide - Bergquist Company - (Version JPG)

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Gap Pad VO®

Conformable,Thermally Conductive Material for Filling Air Gaps

Features and Benefits

• Thermal conductivity: 0.8 W/m-K

• Enhanced puncture, shear and tear resistance

• Conformable gap filling material

• Electrically isolating


TYPICAL PROPERTIES OF GAP PAD VO
PROPERTY	IMPERIAL VALUE	METRIC VALUE	TEST METHOD
Color	Gold/Pink	Gold/Pink	Visual
Reinforcement Carrier	Sil-Pad	Sil-Pad	—
Thickness (inch) / (mm)	0.020 to 0.250	0.508 to 6.350	ASTM D374
Inherent Surface Tack (1- or 2-sided)	1 1
Density (g/cc)	1.6	I.6	ASTM D792
Heat Capacity (J/g-K)	1.0	1.0	ASTM EI269
Hardness, Bulk Rubber (Shore 00) (1)	40	40	ASTM D2240
Young's Modulus (psi) / (kPa) (2)	100	689	ASTM D575
Continuous Use Temp (°F) / (°C)	-76 to 392	-60 to 200	—
ELECTRICAL
Dielectric Breakdown Voltage (Vac)	>6000	>6000	ASTM DI49
Dielectric Constant (1000 Hz)	5.5	5.5	ASTM DI50
Volume Resistivity (Ohm-meter)	I0¹¹	I0¹¹	ASTM D257
Flame Rating	V-O	V-O	U.L. 94
THERMAL
Thermal Conductivity (W/m-K)	0.8	0.8	ASTM D5470
1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus.calculated using 0.01 in/min.step rate of strain with a sample size of 0.79 inch². For more information on Gap Pad modulus.refer to Bergquist Application Note #116.

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Gap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.

Note: Resultant thickness is defined as the final gap thickness of the application.

Typical Applications Include:

• Telecommunications

• Computer and peripherals

• Power conversion

• Between heat-generating semiconductors and a heat sink

• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader

• Between heat-generating magnetic components and a heat sink

Thickness vs. Thermal Resistance Gap Pad VO

. 250 ^m 200 150 100 50 0

Configurations Available:

• Sheet form and die-cut parts

Building a Part Number

I a:

Standard Options

13 5 7 9 11 Thermal Resistance (C-in²/W)

GPVO

NA = Selected standard option. If not selecting a standard option, insert company name, drawing number, and revision level.

0816 = Standard sheet size 8" x 16" or 00 = custom configuration

AC = Adhesive, one side

00 = No pressure sensitive adhesive

Standard thicknesses available: 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"

CU Sì

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- GPVO = Gap Pad VO Material

Note: To build a part number, visit our website at www.bergquistcompany.com. Gap Pad®: U.S. Patent 5,679,457 and others.

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Thermal Interface Selection Guide - Bergquist Company - #9

Keyboard, Adhesive, Printed circuit board, Touch screen, Membrane keyboard