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Bond-Ply

®

660B

Thermally Conductive,Film Reinforced,Pressure Sensitive Adhesive Tape Features and Benefits

TYPICAL PROPERTIES OF BOND-PLY 660B • Designed to replace mechanical fastenersor screws• For applications that requireelectrical isolation• Double-sided pressure sensitiveadhesive tape Bond-Ply 660B is a thermally conductive,electrically insulating,double-sided pressure sensitive adhesive tape.The tape consists of a high performance,thermally conductive acrylic adhesive coated on both sides of a PEN film. Use Bond-Ply 660B in applications to replace mechanical fasteners or screws.

PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD Color White White Visual Reinforcement Carrier PENFilm PEN Film — Thickness (inch) / (mm) 0.0055 0.14 ASTM D374 Temp.Resistance,30 sec.(°F) / (°C) 392 200 — Elongation (%)4040ASTM D412 Tensile Strength (psi) / (MPa) 30000 210 ASTM D412 CTE (ppm) 250 250 ASTM D3386 FR-4 orFlex CircuitBond-Ply 660BMetal Heat Spreader Glass Transition (°F) / (°C) -22 -30 ASTM E1356 Continuous Use Temp (°F) / (°C) -22 to 248 -30 to 120 — ADHESION Lap Shear @ RT (psi) / (MPa) 100 0.7 ASTM D1002 Lap Shear after 5 hr @ 100°C 200 1.4 ASTM D1002 Lap Shear after 2 min @ 200°C 200 1.4 ASTM D1002 Static Dead Weight Shear (°F) / (°C) 302 150 PSTC#7 ELECTRICAL Dielectric Breakdown Voltage (Vac)7000 7000 ASTM D149 Flame RatingV-O V-OU.L.94 THERMAL Thermal Conductivity (W/m-K)0.40.4ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure (psi) 10 25 50 100 200 TO-220 Thermal Performance (°C/W) 5.30 4.94 4.38 4.02 3.88 Thermal Impedance (°C-in
2 /W) (1) 1.15 0.79 0.74 0.72 0.70
1) The ASTM D5470 (Bergquist modified) test fixture was used.The recorded value includes interfacial thermal resistance.These values areprovided for reference only.Actual application performance is directly related to the surface roughness,flatness and pressure applied.

Typical ApplicationsInclude:

Shelf Life: The double-sided pressure sensitive adhesive used in Bond-Ply productsrequiresthe use of dual liners to protect the surfaces from contaminants.Bergquist recommends a6-month shelf life at a maximum continuous storage temperature of 35°C,or 3-month shelf lifeat a maximum continuous storage temperature of 45°C,for maintenanceof controlledadhesion to the liner.The shelf life of the Bond-Ply material,without consideration of liner adhesion (which is often not critical for manual assembly processing),is recommended at12 months from date of manufacture at a maximum continuous storagetemperature of 60°C. • Mount heat sink onto BGA graphic processor• Mount heat sink onto drive processor • Mount heat spreader onto powerconverter PCB• Mount heat spreader onto motorcontrol PCB

Configurations Available: Building a Part NumberStandard Options

Bond-Ply
® : U.S. Patent 5,090,484 and others.
BOND-PLY

• Roll form and die-cut parts The material as delivered will include acontinuous base liner with differential release properties to allow simplicity in roll packaging and application assembly.

–––– NA = Selected standard option. If not selecting a standardoption, insert company name, drawing number, and revision level. BP660B = Bond-Ply 660B Material BP660B0.0055001112NA Section ASection BSection CSection DSection E Standard thicknesses available: 0.0055"00 = No adhesive1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or00 = custom configuration Note: To build a part number, visit our website at www.bergquistcompany.com.

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