Thermal Interface Selection Guide - Bergquist Company - #6

Solution-Driven Thermal Management Products for Electronic Devices

The Bergquist Company a world leader in thermal interface materials, developed the Gap Pad family to meet the electronic industry's growing need for interface materials with greater conformability higher thermal performance and easier application.

The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography air gaps and rough surface textures are present. Bergquist application specialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement.

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Gap Pad thermal products are designed to improve an assembly's thermal performance and reliability while saving time and money. Specifically:

• Eliminates air gaps to reduce thermal resistance

• High conformability reduces interfacial resistance

• Low-stress vibration dampening

• Shock absorbing

• Easy material handling

• Simplified application

• Puncture, shear and tear resistance

• Improved performance for high-heat assemblies

• Compatible with automated dispensing equipment

Some Gap Pad products have special features for particular applications, including:

• Available with or without adhesive

• Rubber-coated fiberglass reinforcement

• Thicknesses from 0.010" to 0.250"

• Available in custom die-cut parts, sheets and rolls (converted or unconverted)

• Custom thicknesses and constructions

• Adhesive or natural inherent tack

• Silicone-free Gap Pad available in thicknesses of 0.010" - 0.125"

• Gap Fillers are well suited for automated dispensing

We produce thousands of specials. Tooling charges vary depending on tolerance and complexity of the part.

Gap Pad products are well suited to a wide variety of electronics, automotive, medical, aerospace and military applications such as:

• Between an IC and a heat sink or chassis.Typical packages include BGA's, QFP SMT power components and magnetics

• Between a semiconductor and heat sink

• CD-ROM/DVDcooling

• Heat pipe assemblies

• RDRAM memory modules

• DDR SDRAM

• Hard drive cooling

• Power supply

• Signal amplifiers

• Between other heat-generating devices and chassis

Each of the many products within the Gap Pad family is unique in its construction, properties and performance. Following is an overview of the important features offered by the Gap Pad family.

• Low-modulus polymer material

• Available with fiberglass/rubber carriers or in a non-reinforced version

• Special fillers to achieve specific thermal and conformability characteristics

• Highly conformable to uneven and rough surfaces

• Electrically isolating

• Natural tack on one or both sides with protective liner

• Variety of thicknesses and hardnesses

• Range of thermal conductivities

• Available in sheets and die-cut parts

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